Advanced Packaging Engineer

SAIC • Bedford, IN

4d

About The Position

SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems.

Requirements

• Bachelor's degree in Mechanical or Aerospace Engineering
• 3+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
• 10+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
• Experience with or knowledge of systems engineering principles
• Interim secret clearance is required to start with the ability to obtain a secret clearance.
• Must be a US citizen

Nice To Haves

• Experience with missile system hardware design and analysis
• Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

Responsibilities

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly
• Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling
• Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation
• Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)
• Collaborate with design teams to facilitate and document design development activities
• Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions
• Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages
• Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations
• Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level