Wet Process Development Engineer

Texas Instruments • Lehi, UT

2d

About The Position

SiGe strained channel and silicided contact integration at 28nm demands wet etch
and clean chemistries that operate at nanometer precision: removing exactly the
right material, at exactly the right selectivity, without disturbing adjacent
films or device structures. At LFAB, these processes don’t yet exist in
production form. You will build them. As a Wet Process Development Engineer in
TI’s ATD organization in Lehi, you will own the development, integration, and
qualification of wet etch and clean modules for the 28nm SiGe and silicidation
device flows which which directly enabling LFAB’s technology ramp from
development to high-volume manufacturing. Your work spans the full arc from
chemistry formulation through module integration, yield analysis, and production
readiness. The wet process modules you develop will run on every wafer at LFAB.

This role requires the ability to manage multiple parallel workstreams under
schedule pressure, lead technical discussions with authority, communicate
status and risks clearly, and drive alignment across organizational
boundaries in a fast-paced technology development environment.

Responsibilities

• Module Integration: Develop and optimize wet process flows for SiGe epi-layer cleaning and selective removal without damage to underlying Si or gate oxide
• Selective Etching: Define chemistries for high-precision isotropic and anisotropic etching with focus on SiGe/Si/silicided film selectivity and undercut control at 28nm geometries
• Yield & Defectivity: Identify root causes of process-related defects using FMEA and 8D methodologies; implement Statistical Process Control (SPC) to support the 28nm yield ramp toward high-volume manufacturing
• Cross-Functional Collaboration: Partner with Epi, Lithography, Spacer Films, and CMP teams to ensure seamless integration of wet modules into the full 28nm SiGe and silicidation fabrication flow
• Metrology & Characterization: Utilize SEM, TEM, ellipsometry, and AFM to characterize surface roughness and etch profiles at atomic resolution

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: No Education Listed