Wafer Level Packaging Process Engineer

Teledyne Technologies Incorporated • Goleta, CA

2d • $113,600 - $151,400 • Hybrid

About The Position

As part of the Uncooled Detector (Focal Plane Array) Production team, we are seeking a WLP(Wafer Level Packaging) Process Engineer with strong wafer bonding experience to support development and volume manufacturing of wafer-level packaging processes. This role will focus on bonding process ownership, tool optimization, yield improvement, and capacity scaling in a cleanroom wafer fab environment. The ideal candidate will bring hands-on experience with wafer bonding technologies (fusion, anodic, eutectic, polymer, or hybrid bonding) and demonstrate the ability to drive process stability, troubleshoot tool/process excursions, and support production ramp. This is a great fit for a self‑directed, technically strong, and collaborative engineer who enjoys hands‑on wafer processing, root‑cause problem solving, and operating in a structured cleanroom production environment. The work environment is a mix of office and cleanroom settings, within a collaborative, supportive, and engaging team culture.

Requirements

• Minimum Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline. Equivalent work experience will be considered.
• 1-3+ years of semiconductor process engineering experience
• Must be US Citizen or PERM Resident

Nice To Haves

• strong wafer bonding experience
• hands-on experience with wafer bonding technologies (fusion, anodic, eutectic, polymer, or hybrid bonding)
• self‑directed, technically strong, and collaborative engineer who enjoys hands‑on wafer processing, root‑cause problem solving, and operating in a structured cleanroom production environment.

Responsibilities

• Own and sustain WLP process line including wafer bonding processes (e.g., fusion, anodic, adhesive/polymer bonding)
• Develop, optimize, and qualify bonding recipes across parameters such as temperature, pressure, vacuum, alignment, and electrical fields
• Lead process characterization and DOE activities to improve yield, uniformity, and defectivity
• Support integration with upstream/downstream modules (e.g., lithography, deposition, testing)
• Serve as tool owner for wafer bonder systems (e.g., EVG, SUSS, or equivalent)
• Troubleshoot equipment issues related to alignment, vacuum integrity, thermal control, bonding interface defects
• Drive tool uptime, PM strategies, and MTTR improvements
• Partner with maintenance and vendors for tool qualification and upgrades
• Support low-rate production (LRP) through high-volume manufacturing (HVM) ramp
• Analyze process excursions and implement corrective actions to minimize scrap
• Monitor SPC metrics and maintain CTQ limits for bonding processes
• Lead continuous improvement initiatives targeting yield and cycle time
• Develop and maintain Process flows, work instructions, and bonding specifications (MES/Camstar-ready)
• Train technicians and engineers on bonding processes and equipment
• Work closely with Process Development, Equipment Engineering, Yield, Quality, and Production teams
• Support capacity planning initiatives (bonding throughput scaling, new tool installs)

Benefits

• Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level