Wafer Bonding Process Engineer, Quantum AI

Google•Goleta, CA

4d•$159,000 - $230,000

About The Position

Google Quantum AI is developing quantum computing for problems that are otherwise unsolvable, with a roadmap focused on advancing quantum computing capabilities and enabling meaningful applications. The Wafer Bonding Process Engineer will lead development, integration, and release to production of temporary wafer bonding, thinning, and debonding processes for next-generation quantum processors. The role involves developing process flows using advanced adhesive bonding chemistries, manufacturable debonding systems, and thin-wafer handling. The engineer will partner with equipment vendors and cleanroom module owners to bring up automated bonding and debonding equipment, coordinate evaluation runs, and transition validated processes into baseline process flows. The role also establishes process controls to mitigate wafer stress, bow, warp, and other downstream integration issues across ultra-thin substrates.

Requirements

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field such as Optics, Sensors, or Audio/DSP, or equivalent practical experience.
At least 3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an R&D or cleanroom production environment.
At least 3 years of experience in temporary wafer bonding, laser or thermal debonding, thin-wafer handling, or back-end packaging processes.

Nice To Haves

Master’s degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field such as Optics, Sensors, or Audio/DSP.
Experience mitigating mechanical stress, bow, warp, and micro-cracking in ultra-thin silicon substrates, integrated with backside thinning and dicing-on-tape workflows.
Experience executing 3D integration technical roadmaps and complex development and process integration projects.
Collaborative leadership skills and experience leading technical evaluations with equipment vendors, managing joint development projects, and cross-training or mentoring engineers and technicians.
Expertise in polymer adhesives, temporary bonding materials, and release processes.
Experience owning qualification of automated temporary bonding, lamination, and laser or mechanical debonding tools.

Responsibilities

Develop, integrate, and transition to production temporary adhesive bonding and laser debond processes and equipment for advanced 3D integration of quantum devices.
Specify, bring up, and qualify required cleanroom equipment and advanced metrology capabilities, establishing baseline operational recipes and documentation.
Drive process integration activities around wafer thinning, thin-wafer handling, and stress and warp mitigation.
Coordinate vendor evaluations, off-site demonstrations, technology transfers, and release to production of tools and processes into quantum device production processes.
Troubleshoot processing anomalies, improve yield, and train cleanroom personnel and technicians on standard operating procedures.