Thermal Engineer - Server Platform Engineering

Qualcomm•Santa Clara, CA

About The Position

Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! Our Mission: We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more. About the Role: As an experienced Thermal Engineer (individual contributor), you will work closely with the platform team in developing high-performance servers, collaborating with cross-functional teams including packaging, electrical, mechanical, and component suppliers. You will be primarily responsible for hands-on lab work — conducting thermal testing, characterization, and validation — while also supporting thermal modeling and simulation efforts to develop and improve thermal solutions for high-performance computing systems.

Requirements

Bachelor's or Master's degree in Mechanical Engineering, Engineering Mechanics, Material Science, or related field.
5+ years of hands-on experience in thermal engineering within the high-tech industry — practical, lab-based experience is critical.
Strong background in heat transfer fundamentals, including conduction, convection, and radiation.
Proven hands-on experience with thermal testing equipment and methodologies, including: Heat sink and cold plate characterization, Air cooling and liquid cooling systems, Wind tunnel testing, Temperature measurements (e.g., thermocouples, IR thermography), Flow metrology techniques
Hands-on experience with thermal interface materials (TIMs) selection, application, and characterization.
Familiarity with thermal challenges associated with package design and silicon architecture, and an understanding of why capable thermal solutions are critical to product performance and reliability.
Some experience with thermal simulation tools (e.g., Celsius EC, Flotherm, Icepak) to support and complement experimental work.
Proven ability to work independently and collaboratively within a cross-functional team environment.
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
Master's degree in Engineering, Information Systems, Computer Science, or related field and 5+ years of Systems Engineering or related work experience.
PhD in Engineering, Information Systems, Computer Science, or related field and 4+ years of Systems Engineering or related work experience.

Nice To Haves

Experience addressing data center thermal challenges, including high-density compute and rack-level thermal management.
Experience with Open Compute Project (OCP) product designs and standards.
Advanced proficiency in CFD tools (e.g., Celsius EC, Flotherm, Icepak) for more complex simulations.
Experience with scripting or programming languages (e.g., Python, MATLAB) for data analysis and automation.
Familiarity with industry standards and best practices for thermal management in server and data center environments.
Strong communication and presentation skills, with the ability to clearly convey complex technical concepts to diverse audiences.

Responsibilities

Lead and execute hands-on thermal testing and characterization of server hardware, including heat sinks, cold plates, air cooling and liquid cooling solutions, wind tunnel evaluations, temperature measurements, and flow metrology.
Validate and improve thermal models and solutions through rigorous lab testing, enhancing accuracy, and real-world robustness
Support thermal simulations at the die/package/system level to analyze and optimize thermals, complementing experimental findings.
Collaborate with internal teams — including packaging, silicon architecture, mechanical, and system engineering — to provide technical guidance and ensure alignment across requirements.
Apply hands-on knowledge of thermal interface materials (TIMs) to evaluate, select, and qualify materials for high-performance electronics.
Contribute to solving data center-specific thermal challenges, including rack-level cooling, high-density compute environments, and airflow management.
Understand silicon architecture thermal challenges and develop capable thermal solutions that are critical to product performance and reliability.
Develop and maintain documentation, guidelines, and tools to support design processes and project success.
Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.