Thermal Engineer

Arieca•Pittsburgh, PA

2d•$65,000 - $90,000•Onsite

About The Position

Arieca is looking for a Thermal Engineer who will join our Hardware R&D team to assist the successful market introduction of our thermal interface materials (TIM). Responsibilities include design and implementation of liquid cooling solutions for thermal test vehicles, in addition to designing and implementing experiments to test hypotheses on understanding the thermo-mechanical properties of semiconductor interfaces in packaged electronics (smartphones, laptops, GPUs). Strong organizational, analytical and communication skills are required, as we need to collect data efficiently and create professional customer facing documentation, while developing processes and systems that work well within the constraints of a startup. Engagement with customers, external vendors and ecosystem partners is possible. You will be working with a team of highly motivated and ambitious individuals with a diverse background of exceptional scientific, entrepreneurial, and industrial experiences.

Requirements

Minimum of 1-3 years of experience working in industry or an academic research laboratory, with significant hands-on work on single phase liquid cooling solutions (implementation of cold plates, heaters, thermocouples, pumps, chillers, etc.)
Experience with microcontrollers like Arduino and Raspberry Pi for real time physical control and data collection/processing and system management
Solid foundation in thermal science, including material characterization (e.g. ASTM D5470, thermal test vehicles)
Familiar with at least one thermomechanical simulation tool (Ansys, Autodesk Fusion, etc.).
Experience with scientific programming in Python, Matlab, or C++.
Bachelor of Science or higher in Mechanical Engineering, Electrical Engineering, Mechatronics, or equivalent degrees.
Meticulous organizational skills, attention to detail, and pride in producing high-quality work

Nice To Haves

Experience designing analog electrical circuits, semiconductor packages or substrates (flip-chip, BGA, LGA, etc.), or data acquisition systems
Rapid prototyping and machine shop experience.
Experience in semiconductor industry, nondestructive testing or reliability engineering.
Expertise in designing GUIs in LabView can substitute for scientific programming expertise.

Responsibilities

Design and implementation of liquid cooling solutions for thermal test vehicles.
Designing and implementing experiments to test hypotheses on understanding the thermo-mechanical properties of semiconductor interfaces in packaged electronics (smartphones, laptops, GPUs).
Collect data efficiently and create professional customer facing documentation.
Developing processes and systems that work well within the constraints of a startup.
Engagement with customers, external vendors and ecosystem partners is possible.