Thermal Engineer – Electronic Cooling

Amphenol ICC•Yocumtown, PA

2d•Onsite

About The Position

Amphenol High Speed Products Group is the market leader for high-speed, high-bandwidth electrical connectors for the Telecom/Datacom market (Mobile Networks, Storage, Servers, Routers, Switches, etc.). Our products help to enable the electronics revolution and remain a key enabler for all the major Tier 1 OEMs globally. We are currently seeking a Thermal Engineer - Electronic Cooling to join our team. The position will be located in Etters, PA. Position Overview We are seeking a highly motivated Thermal Engineer to join our Active Thermal Solutions team. This role is responsible for developing and optimizing active thermal management solutions for high-speed interconnect systems. The ideal candidate will collaborate closely with customers to define boundary conditions, perform thermal simulations, validate designs through lab testing, and deliver optimized, production-ready thermal solutions that meet performance, reliability, and manufacturability requirements.

Requirements

Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or a related field.
3+ years of industry experience in thermal design or analysis for cooling electronic systems or interconnect hardware preferred.
Proficiency with CFD tools (ANSYS Icepak, FloTHERM, or equivalent).
Experience with thermal instrumentation and data acquisition (thermocouples, IR cameras, etc.).
Familiarity with CAD software (SolidWorks, Creo, NX, or similar).
Strong understanding of heat transfer, fluid dynamics, and electronic packaging.
Excellent problem-solving and analytical skills.
Strong communication and presentation abilities for customer interaction and reporting.
Ability to manage multiple projects in a fast-paced environment.

Nice To Haves

Experience developing thermal cooling solutions for electronics packages , such as; ASICs, Front I/O modules, Near package & On-package optics, cold plates, and other electronic liquid cooling solutions.
Background in active cooling technologies (fans, blowers, heat pipes, vapor chambers, etc.).
Understanding of electrical and mechanical design trade-offs in system integration.
Experience with Design of Experiments (DOE) or statistical optimization methods.

Responsibilities

Engage directly with customers to gather thermal boundary conditions, system-level constraints, and performance requirements.
Translate customer needs into actionable simulation and test plans.
Develop and execute thermal models using CFD tools (e.g., ANSYS Icepak, FloTHERM, or equivalent).
Analyze airflow, temperature distribution, and heat dissipation for active thermal solutions in high-density electronic cooling environments.
Perform sensitivity and optimization studies to ensure thermal performance meets design goals.
Work with lab teams to plan and conduct thermal testing and validation.
Correlate experimental data with simulation results to refine and validate models.
Identify and troubleshoot thermal design issues through root-cause analysis and iterative testing.
Optimize designs based on simulation and test results to balance performance, cost, and manufacturability.
Prepare detailed technical reports summarizing analysis, findings, and recommendations.
Present results and optimized solutions to customers and cross-functional teams.