Thermal Engineer-Data Center AI GPU Thermal Design

Advanced Micro Devices, Inc•Austin, TX

5d•Onsite

About The Position

Join AMD's Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team and play a key role in shaping the future of AI computing. This team owns the end-to-end thermal architecture, validation, and deployment of AMD's industry-leading MI Series AI accelerators and data center GPU platforms. Engineers on this team work at the intersection of cutting-edge AI hardware, advanced cooling technologies, and large-scale data center infrastructure. This is an opportunity to collaborate with world-class engineers across silicon design, board engineering, validation, manufacturing, and product development while helping bring next-generation AI products to market. The successful candidate will contribute to thermal innovation from concept through production and gain hands-on experience with advanced cooling technologies that power some of the most demanding computing workloads in the world. The role offers a unique combination of hands-on laboratory work, thermal modeling, design analysis, and technology development in a fast-paced environment focused on solving complex engineering challenges and enabling AMD's AI roadmap.

Requirements

Master's degree or PhD preferred in Mechanical Engineering.
Advanced degrees in Aerospace Engineering, Chemical Engineering, Thermal Sciences, Fluid Mechanics, or related engineering disciplines with a strong thermal focus are also desired.
Research focused on thermal management, fluid dynamics, electronics cooling, computational modeling, or related areas is preferred.

Nice To Haves

Strong background in heat transfer, fluid dynamics, and electronics cooling technologies.
Experience with thermal management solutions for high-performance computing, data center, server, or AI hardware environments.
Experience using CFD tools such as Icepak, ANSYS AEDT, or similar simulation platforms.
Knowledge of air-cooled and liquid-cooled thermal design methodologies.
Experience with thermal laboratory testing, design of experiments (DOE), instrumentation, data acquisition, and data analysis.
Experience developing liquid cooling solutions including cold plates, liquid interconnects, manifolds, and related cooling technologies.
Familiarity with thermal design components such as thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and fans.
Experience with CAD tools such as SolidWorks or Creo.
Exposure to scripting, automation, or data analysis tools including Python, MATLAB, C/C++, or similar languages.
Internship, research, or industry experience related to data center infrastructure, semiconductor products, AI accelerators, GPUs, or hyperscale computing environments is highly desirable.

Responsibilities

Design and develop thermal solutions supporting AMD's next generation of data center GPU and AI accelerator products.
Collaborate with silicon, board, power, validation, manufacturing, and platform engineering teams to deliver innovative thermal-mechanical solutions from component to system level.
Perform thermal validation activities including test planning, laboratory experimentation, data collection, and analysis.
Contribute to thermal modeling and simulation efforts to support product development and design optimization.
Investigate, evaluate, and advance emerging cooling technologies aligned with AMD's future product roadmap.
Support product development activities from concept through commercialization and mass production.
During the first several months, become familiar with AMD thermal design methodologies, tools, products, and development processes while contributing to active engineering projects.
Over time, take ownership of critical thermal design and validation efforts, develop domain expertise, and become a key contributor to next-generation AI platform development.