About The Position

SpaceX is bringing integrated circuit packaging and assembly in-house for Starlink development and manufacturing. The Test Technician will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership to support the quality, reliability, cost, manufacturability, throughput, and security of Starlink products. The role involves wafer-level and packaged-device testing, equipment operation and maintenance, test-data logging, and collaboration to meet production volumes in a cleanroom environment.

Requirements

  • High school diploma or equivalency certificate.
  • At least 6 years of professional experience in a hands-on manufacturing environment, or a bachelor's degree in an engineering, math, or science discipline.
  • Must be able to work all shifts and be willing to work overtime and/or weekends as needed.
  • Must be able to lift up to 25 lbs. unassisted.
  • Must meet the stated U.S. export-control eligibility requirements or be eligible to obtain the required authorizations.

Nice To Haves

  • Bachelor's degree in an engineering, math, or science discipline.
  • At least 3 years of experience in wafer probing or RF package testing in a semiconductor manufacturing or test environment.
  • Experience with automated wafer probing systems and backend assembled package testers.
  • Knowledge of electrical theory, including digital, analog, and RF circuitry.
  • Proficiency with RF test equipment, including VNAs, spectrum analyzers, and oscilloscopes, and understanding of semiconductor device physics and RF parameters.
  • Proficiency with test software and data logging tools such as Excel and JMP.
  • Ability to fabricate and repair cable harnesses, including soldering, crimping, and assembling connectors for bench testing, debugging, and failure analysis; J-STD-001 certification is a plus.
  • Excellent manual dexterity and ability to rework microminiature electronic components under a microscope.

Responsibilities

  • Perform wafer-level probing and testing with DC/RF probe stations, parametric analyzers, and VNAs, measuring I-V characteristics, capacitance, RF insertion loss, and return loss on individual dies.
  • Set up and operate RF package test stations, including test sockets, handlers, and VNAs, for parametric, functional, and high-frequency testing such as S-parameter sweeps, gain measurements, and noise figure evaluations.
  • Load and unload packaged devices into ATE and follow recipes for sort tests, binning, and data collection for yield tracking and performance grading.
  • Inspect test results using software interfaces, identify outliers or failures, generate simple defect reports, and flag issues for engineering review.
  • Perform routine equipment maintenance, including calibrating RF cables, cleaning fixtures, and verifying probe contacts.
  • Log test data, throughput metrics, and SPC charts in software to support production reporting and defect trend analysis.
  • Collaborate cross-functionally to achieve daily test volumes and assist with simple setup changes or fixture preparations.
  • Follow cleanroom protocols, ESD safeguards, and safety standards when handling sensitive RF components.
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