Technical Project/Program Management Director - Advanced Packaging

Applied Materials•Santa Clara, CA

1d•$172,000 - $237,000•Onsite

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Requirements

Master's Degree
10+ Years
Functional Knowledge: Recognized as a subject matter expert with broad and comprehensive understanding of advanced packaging systems, capability development, and integration challenge. Demonstrates broad and comprehensive expertise in leading-edge theories, techniques and/or technologies within own field.
Business Expertise: Influences internal/external business and/or regulatory issues that have an impact on the business.
Leadership: Leads highly visible, complex, cross-functional initiatives requiring coordination across a matrixed organization; provides strategic and operational leadership.
Problem Solving: Proactively identifies and solves the most complex problems; uses ground-breaking methods to think beyond existing solutions.
Impact: Impacts business direction through successful execution of advanced packaging programs, new capability development, and system-level innovation including interconnect scaling.
Interpersonal Skills: Communicates effectively with senior leadership, partners, customers, and cross-functional stakeholders to align priorities, resolve conflicts, and drive execution.

Responsibilities

Technical program expert providing oversight from conception and planning to implementation for new capability development in advanced packaging technologies, including interconnect scaling initiatives.
Ensures strategies, processes, and resources are aligned to program objectives, budgets, and release schedules.
Defines and drives program scope and objectives based on: Customer requirements and specifications, or Internal product and technology roadmap initiatives.
Responsible for managing long range schedule and task details by utilizing project management tools such as reports, tracking charts, checklists, and project scheduling software.
Drives allocated resources from other organizations to achieve on-time and within budget performance objectives for the project.
Initiates and manages capital allocation requests, purchase requisitions, and purchase orders.
Works with senior business group management to ensure program alignment with business unit strategy, including development of advanced packaging solutions and scaling roadmaps.
Leads multifunctional teams across internal and external stakeholders to execute complex programs, providing technical and operational leadership to achieve program milestones
Interfaces and coordinates with business unit senior management to define program objectives, provide status updates and supports decision-making for release, deployment, and customer engagements.
Applies engineering and business process expertise to resolve complex, cross-functional program challenges, particularly in areas of process integration, capability readiness, and system-level performance.
Contributes and leads technical and program review forums, ensuring readiness and alignment across functions for key milestones for assigned programs.