Technical Fellow, Advanced Packaging Integration
About The Position
At TechInsights, we decode technology to reveal the innovations shaping our world. As the Technical Fellow, Advanced Packaging Integration, you’ll be a central figure in that mission, a recognized technical authority who bridges advanced packaging, processor architecture, and system-level performance. This is a rare opportunity to shape the technical direction of two of TechInsights’ most dynamic product areas: Advanced Packaging and High Performance Computing. You will bring deep expertise in advanced packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration. Your leadership will help define how TechInsights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.
Requirements
- A recognized expert in semiconductor packaging, interconnect, or processor design, with 10+ years of relevant industry experience.
- Master’s or PhD in Nanotechnology, Electrical Engineering, Materials Science, Applied Physics, or equivalent field experience.
- Adept at connecting materials, process, and architecture to system-level performance in HPC or networking applications.
- Deeply familiar with one or more of the following domains: Advanced packaging and assembly processes (TSVs, interposers, hybrid bonding, fan-out, glass core, embedded passives); Processor and chiplet architecture (CPU, GPU, DPU, TPU, FPGA, ASIC); System-level power, thermal, and performance analysis.
- Demonstrated success applying AI and automation tools to accelerate technical content or workflow efficiency.
- An effective communicator and storyteller comfortable engaging with engineers, executives, and customers alike.
- Motivated by curiosity, collaboration, and a desire to define what comes next in semiconductor analysis.
- Willing to travel globally (up to 25%) to build relationships and represent TechInsights at technical and industry events.
Responsibilities
- Serve as TechInsights’ subject matter expert across advanced packaging, HPC processors, networking ASICs, and memory integration.
- Provide authoritative insights on leading-edge and emerging packaging and system integration technologies, including: 2.5D/3D integration, hybrid bonding, fan-out, glass core substrates, and embedded passives; Co-packaged optics, chip-to-chip optical engines, and photonic-electronic IC integration (PIC + EIC); Hybrid bonded chiplet stacks, SRAM chiplets, and next-generation thermal and power delivery innovations.
- Shape and maintain TechInsights’ Advanced Packaging and HPC technology roadmaps, aligning analysis coverage with industry trends and customer value.
- Identify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms to capture market-defining innovations.
- Help drive product evolution toward system-level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking.
- Leverage AI-enabled tools and data workflows to increase the speed, accuracy, and scalability of analysis.
- Create and apply new techniques that connect process flow, packaging design, and system performance metrics.
- Assertively drive content velocity and analytical quality across teams.
- Represent TechInsights worldwide to present at conferences, lead customer technical discussions, and publish thought leadership that positions TechInsights at the forefront of semiconductor intelligence.
- Mentor analysts, shape analytical methods, and foster cross-domain collaboration between packaging, logic, memory, and system analysis teams.
- Travel internationally to meet with hyperscalers, foundries, fabless companies, and system manufacturers.
Benefits
- Company-sponsored training and development opportunities
- Comprehensive benefits package (health, dental, vision, wellness, RRSP/401K Matching, annual fitness reimbursement)
- Flexible vacation policy
- Trusted device reimbursement program
- Community involvement opportunities through charitable alliances
- Wellness resources and support
- Inclusive environment that prioritizes diversity, equity, and accessibility
- High-growth company driven by high performance
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What This Job Offers
Job Type
Full-time
Career Level
Senior
