T1 CVD Process Engineering Team Leader

Samsung•Taylor, TX

1d•Onsite

About The Position

Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow. Come innovate with us! Position Summary In your role as the Chemical Vapor Deposition (CVD) / Thin Films 1st-level Process Engineering Leader to head the front-end-of-line (FEOL) process engineering sub team dedicated to processes within the NS, PC, SD, RPMG, CT-SDB, and MOL modules. You'll manage and develop up to 15 engineers in this role.

Requirements

Minimum educational requirement: Bachelor’s degree in an engineering discipline (Chemical, Mechanical, Electrical) or related degree (Materials Engineering, Physics, Chemistry, etc.)
Minimum work experience: 5+ years’ experience in high volume semiconductor manufacturing
Leadership experience: 2+ years leadership experience of at least 5 or more people, or 4+ years technical leadership experience leading task force teams
Legal authorization to work in the United States without sponsorship
The applicant should possess a high level of technical understanding if semiconductor processes and integration for advanced node devices.

Responsibilities

The process team lead must understand department objectives and provide effective oversight to their team members to achieve targets for safety, quality, and production.
Translating departmental goals into measurable tasks for their team.
Focus on hitting key tool installation milestones to achieve capacity goals.
Hiring and work scheduling.
Developing training plans for new employees.
Providing professional / career development feedback to your direct reports.
Developing a high-performance learning-first team culture that aligns with the department and Samsung.
Facilitating annual performance management and compensation process for your direct reports.
Coordinate with external and internal teams to meet objectives.
Process ownership assignment.
Provide technical guidance to direct reports for FEOL processes.
Developing / approving safety-minded standard operating procedures to guide wafer disposition.
Understanding and managing risk when an abnormality or schedule deviation is detected.
Ensuring the team adheres to sitewide safety standards and communicating safety bulletins to the team.
Coordinating with tool vendors to prioritize process work and communicating help needs.
Managing non-product wafer and quality lot schedules through mass productions to meet manufacturing need dates.
Communicating technical information to executive leadership.
Defense line and automatic process control (APC) application to achieve film quality targets and minimize scrap.
Co-work with equipment team to match new tool output to reference tool (tool-to-tool matching).