CVD Process Team Lead

Samsung Electronics•Austin, TX

3d•$113,500 - $200,500•Onsite

About The Position

Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow. Come innovate with us! In your role as the Chemical Vapor Deposition (CVD) / Thin Films 1st-level Process Engineering Leader to head the front-end-of-line (FEOL) process engineering sub team dedicated to processes within the NS, PC, SD, RPMG, CT-SDB, and MOL modules. You'll manage and develop up to 15 engineers in this role.

Requirements

Bachelor’s degree in an engineering discipline (Chemical, Mechanical, Electrical) or related degree (Materials Engineering, Physics, Chemistry, etc.)
5+ years experience in high volume semiconductor manufacturing
2+ years leadership experience of at least 5 or more people, or 4+ years technical leadership experience leading task force teams
Legal authorization to work in the United States without sponsorship
High level of technical understanding of semiconductor processes and integration for advanced node devices.

Responsibilities

Understand department objectives and provide effective oversight to their team members to achieve targets for safety, quality, and production.
Translate departmental goals into measurable tasks for their team, focusing on hitting key tool installation milestones to achieve capacity goals.
Manage staffing, including hiring and work scheduling.
Develop training plans for new employees.
Provide professional/career development feedback to direct reports.
Develop a high-performance, learning-first team culture that aligns with the department and Samsung.
Facilitate annual performance management and compensation process for direct reports.
Coordinate with external and internal teams to meet objectives.
Assign process ownership.
Provide technical guidance to direct reports for FEOL processes.
Develop/approve safety-minded standard operating procedures to guide wafer disposition.
Understand and manage risk when an abnormality or schedule deviation is detected.
Ensure the team adheres to sitewide safety standards and communicate safety bulletins to the team.
Coordinate with tool vendors to prioritize process work and communicate help needs.
Manage non-product wafer and qual lot schedules through mass production to meet manufacturing need dates.
Communicate technical information to executive leadership.
Apply defense line and automatic process control (APC) to achieve film quality targets and minimize scrap.
Co-work with the equipment team to match new tool output to reference tool (tool-to-tool matching).