System Thermal Engineer

Hyve Solutions•Fremont, CA

6d•$110,000 - $185,000

About The Position

As a Staff-level System Thermal Engineer, you will execute hands-on thermal design and validation for Hyve's next-generation AI and compute servers, working alongside the Principal thermal lead and cross-functional hardware teams. You will design and test air-cooled and liquid-cooled solutions, run thermal and CFD analysis, and support bring-up and production ramp to ensure platforms meet performance, reliability, and manufacturability targets.

Requirements

Bachelor's or Master's in Mechanical Engineering, Thermal Engineering, or a related discipline.
8+ years of hands-on thermal design experience for servers, GPU platforms, or high-power electronics, including system bring-up and validation.
Solid working knowledge of airflow and thermal design, heatsinks and cold plates, CFD/thermal modeling tools, and lab instrumentation and measurement techniques.
Hands-on problem solver comfortable in lab environments, with the ability to turn thermal data into practical design changes and communicate clearly across teams.

Nice To Haves

Exposure to liquid cooling and hyperscale deployments preferred.

Responsibilities

System thermal design. Develop and optimize airflow paths, heatsinks, cold plates, and fan/ducting solutions for high-power GPU, CPU, VR, and memory components across air-cooled and liquid-cooled platforms.
Thermal modeling and analysis. Perform CFD and thermal simulations to guide component placement, system layout, and cooling margin evaluation under worst-case workloads and environmental conditions.
Lab validation. Instrument systems with temperature, flow, and pressure sensors; execute thermal characterization, stress testing, and margin validation, and correlate results with simulation.
Bring-up and debug. Support thermal bring-up during EVT/DVT/PVT, debug hotspots and airflow/flow inefficiencies, and help drive corrective actions through factory ramp.
Cross-functional execution. Collaborate with mechanical, hardware, power, and manufacturing teams to embed thermal requirements into board layouts, mechanical stackups, and rack packaging, and participate in design reviews with data-driven recommendations.