WD is recruiting for current and anticipated early-career Hardware Engineering internship opportunities for Summer 2027. Applicants may be considered for roles aligned with their qualifications, preferences, and availability; applying does not guarantee an immediate opening or interview. Opportunities may be located in Colorado Springs, Colorado; Irvine, California; Longmont, Colorado; Fremont, California; Rochester, Minnesota; or San Jose, California. The posting covers a range of engineering disciplines: ASIC Engineering; Hardware Development Engineering; Firmware Engineering; Systems Design & Integration Engineering; Mechanical Design Engineering; Equipment Engineering; and System-on-Chip (SoC) Engineering. Work may involve designing and verifying ASIC architectures and digital logic; developing, prototyping, validating, and testing electronic hardware and magnetic recording systems; creating embedded firmware; integrating hardware, firmware, and software; designing mechanical components and assemblies; optimizing manufacturing equipment; or designing and validating SoC components and subsystems. Across these areas, interns work with engineering teams on product performance, reliability, validation, debugging, and development from concept or design through manufacturing or system integration. This internship is part of WD’s early career development program, which provides structured onboarding, mentorship, foundational training, and a curated development curriculum. The responsibilities are typically aligned with candidates who have approximately 0–2+ years of relevant professional experience, although candidates of all experience levels are encouraged to apply. The posting lists a salary range of $34.52–$46.00. The position is non-exempt. The location listed for this posting is WD’s San Jose Great Oaks Headquarters.
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Job Type
Full-time
Career Level
Intern