Substrate Packaging Research and Development Engineer

Intel Corporation•Chandler, AZ

4d•$133,800 - $188,890•Hybrid

About The Position

As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and equipment. Your day-to-day responsibilities will focus on optimizing assembly methods to achieve quality, reliability, and efficiency goals in high-volume manufacturing environments. By collaborating with cross-functional teams, you will help shape Intel's next-generation packaging technologies, directly contributing to the company's success in the semiconductor industry. This position is part of Intel Corporation's Substrate Packaging Technology Development (SPTD) organization, which drives advancements in substrate packaging to support Intel's global technology leadership. The group focuses on delivering next-generation solutions for high-performance and mobile computing applications, enabling heterogeneous integration and die disaggregation across Intel's product portfolio.

Requirements

PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or other similar engineering degree and 1+years of related experience.
1+year of experience in: Combining engineering judgement and data analysis skills to draw conclusions, build models and design experiments.
1+year of experience in: Materials science and engineering, and in material characterization techniques.
1+year of experience in: Knowledge and experience in design of experiments (DOE), statistical data analysis and statistical process control (SPC).

Nice To Haves

Working knowledge and/or prior experience in optics and lasers, laser micro-machining and micro-fabrication.

Responsibilities

Develop and optimize advanced packaging processes, materials, and equipment to meet reliability, quality, and cost targets.
Design and implement process specifications, workflows, and equipment configurations for new technologies.
Conduct design of experiments (DOE) to characterize process windows and interactions between equipment, materials, and chemistry.
Drive continuous improvement efforts to enhance process capability, stability, and productivity.
Collaborate with cross-functional teams to resolve technical challenges and deliver impactful solutions.
Establish material specifications and partner with suppliers to ensure adherence to performance and quality standards.
Document advancements and process innovations through technical reports and white papers.
Provide sustaining support for equipment performance and process health in high-volume manufacturing environments.