Substrate Packaging Research and Development Engineer

Intel Corporation•Chandler, AZ

1d•$133,800 - $188,890•Hybrid

About The Position

Intel is seeking a Substrate Packaging Research and Development Engineer to join our Packaging Technology Development organization. In this role, you will develop innovative assembly processes and equipment solutions that enable Intel’s future packaging technology roadmap. You will be responsible for driving process development, equipment optimization, package reliability, and manufacturing excellence for advanced package assembly technologies. The successful candidate will leverage engineering fundamentals, experimental design, statistical analysis, and problem-solving skills to develop and qualify new packaging solutions while ensuring quality, reliability, manufacturability, and cost competitiveness.

Requirements

PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or other similar engineering degree.
2+year of prior experience in Combining engineering judgement and data analysis skills to draw conclusions, build models and design experiments.
Materials science and engineering, and in material characterization techniques.
Design of experiments, statistical data analysis and statistical process control.

Nice To Haves

Working knowledge and/or prior experience in optics and lasers, laser micro-machining and micro-fabrication.

Responsibilities

Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.