The successful candidate will be responsible for conducting stress analysis of electronic enclosures in modal, static structural, and shock simulations. They will utilize standard design principles to meet structural design requirements, generate stress analysis products to support data packages, peer reviews, and external customer reviews, and use classical stress and strain methods and software to predict structural integrity and failure and design flight components. The role involves selecting and/or modifying proven methods, mathematical formulas, previous design and test information, handbook data or other available information related to the assignment. The candidate will produce engineering documentation and technical reports/analyses to support design, integration, and testing efforts, conduct trade studies and develop component specifications and procedures as required. They will interact with component analysis, manufacturing, project engineering, quality and customer support groups, and plan and execute design tasks with limited general direction and work effectively within an Integrated Product Team (IPT) environment. Work is reviewed by senior staff.
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Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed