Staff SoC Physical Verification Engineer, HBM

Micron Technology • Richardson, TX

1d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Physical Verification Engineer, you will be a key technical contributor within the Heterogeneous Integration Group (HIG), responsible for defining, executing, and driving sign-off quality physical verification flows for next‑generation HBM logic die and memory‑centric SoCs. You will work across physical design, design rule development, EDA tool teams, foundry interfaces, and product engineering teams to deliver industry‑leading, tape-out-ready silicon under aggressive schedule, quality, and reliability constraints. This role combines full-chip physical verification ownership — including DRC, LVS, ERC, and DFM — with deep collaboration across implementation and silicon bring‑up, ensuring design integrity from layout through first silicon.

Requirements

• Strong experience with full‑chip or block‑level physical verification for advanced‑node system‑on‑chip, memory, or heterogeneous integration designs.
• Deep hands‑on expertise in physical verification methodologies, including DRC, LVS, ERC, PERC, DFM, antenna, and reliability sign‑off.
• Experience using industry physical verification tools such as Calibre, IC Validator (ICV), Pegasus, or similar, including rule deck development or customization.
• Working knowledge of full RTL‑to‑GDS implementation flows, including place‑and‑route, extraction, and their impact on physical verification outcomes.
• Ability to drive verification closure through strong cross‑functional communication in a global engineering environment.

Nice To Haves

• Experience with high‑bandwidth memory (HBM), DRAM, or memory‑centric system‑on‑chip physical verification, including multi‑die, chiplet, or 2.5D/3D integration.
• Background in GPU, CPU, or high‑performance accelerator physical implementation at advanced process nodes with aggressive sign‑off and tape‑out schedules.
• Familiarity with foundry design rule documents, front‑end‑of‑line (FEOL) and back‑end‑of‑line (BEOL) rules, and advanced design for manufacturability best practices.
• Exposure to post‑silicon failure analysis, yield learning, or layout‑based debug with correlation between physical verification results and silicon behavior.
• Master’s or PhD in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience, with 10 or more years of relevant industry experience including mentoring engineers and driving physical verification methodology improvements.

Responsibilities

• Lead end‑to‑end physical verification sign‑off for full‑chip and hierarchical designs, including Design Rule Check (DRC), Layout Versus Schematic (LVS), Electrical Rule Check (ERC), Physical Electrical Rule Check (PERC), antenna checking, and Design for Manufacturability (DFM).
• Execute and debug foundry‑qualified rule decks, manage waivers, and drive clean closure while ensuring compliance with advanced‑node foundry requirements.
• Perform reliability verification across multiple power domains, including electrostatic discharge (ESD), latch‑up, electromigration, floating nets, and connectivity checks.
• Run density, metal fill, and chemical mechanical polishing (CMP) checks to ensure yield‑aware manufacturability at 3 nanometer and below.
• Perform parasitic resistance‑capacitance (RC) extraction and support correlation of physical verification results with post‑silicon measurements.
• Develop, maintain, and optimize physical verification flows, automation, and regression infrastructure using Python, Tcl, Perl, or similar scripting languages.
• Drive adoption of machine learning (ML) and artificial intelligence (AI)‑based physical verification and power‑performance‑area (PPA) optimization tools.
• Partner with physical design, custom layout, computer‑aided design (CAD), register‑transfer level (RTL), product engineering, EDA, and foundry teams, including direct interface with TSMC, from design kick‑off through tape‑out readiness and sign‑off decision gates.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior