Staff Process Engineer

Precision Neuroscience•Addison, TX
•Onsite

About The Position

Precision Neuroscience is seeking a Staff Process Engineer to lead front-end microfabrication process development for new products and R&D programs at its Addison, Texas facility. The role bridges R&D and production, taking new device designs and process concepts from early builds through qualification and release. The engineer owns a front-end process flow and brings deep expertise in at least one module—photolithography, thin-film deposition, or etch—while understanding how process changes affect downstream steps. The position involves designing experiments, operating tools, establishing process windows, qualifying processes and equipment, and documenting processes for handoff to the sustaining team. As a technical lead, the engineer mentors engineers and technicians, reviews designs for manufacturability, and advises R&D on buildability and timing. The role is based in the Addison, TX office; remote workers and individuals not currently based in the US and legally authorized to work in the US will not be considered.

Requirements

  • BS in Engineering, Materials Science, Chemistry, Physics, or a related technical field and 5–10 years of relevant experience; or MS in one of these fields and 3–8 years of relevant experience; or PhD in a related technical field and 1–5 years of relevant experience.
  • Deep, hands-on expertise in at least one front-end microfabrication module, with working knowledge of the rest of the flow: photolithography; thin-film deposition (PECVD, HDPCVD, and PVD, including sputter and e-beam); or etch (ICP RIE, DRIE, and wet chemistry).
  • Track record of taking processes from development through qualification and release into production, such as through NPI, technology transfer, or pilot-to-production.
  • Strong experimental design and data analysis skills, including DOE, SPC, process capability (Cpk), and structured root-cause methods.
  • Experience with film and process characterization, including thickness, refractive index, stress, CD, etch rate, profilometry, and SEM.
  • Experience with process and equipment qualification (SAT, IQ/OQ/PQ), including writing protocols and reports.
  • Proficiency in 2D layout and photolithography mask design using L-Edit or KLayout, including design rule development.
  • Demonstrated technical leadership, including mentoring engineers and technicians, leading a workstream, and influencing without direct authority.
  • Clear written and verbal communication skills, including preparing technical reports and presenting data to cross-functional and leadership audiences.
  • Must be currently based in the US and legally authorized to work in the US; remote workers are not considered.

Nice To Haves

  • Experience in Class II or Class III medical device manufacturing under FDA QSR (21 CFR Part 820 / QMSR) or ISO 13485, including design transfer, process validation, and change control.
  • Process integration experience with MEMS, thin-film, or flexible polymer-based devices; neural interfaces or other biomedical microdevices are a plus.
  • Experience with polymer substrates and dielectric or ceramic barrier stacks, including low thermal budget processing.
  • Experience specifying and bringing up new front-end equipment, from purchase specification through SAT and release.
  • Process FMEA and control plan experience.
  • Data-analysis fluency with JMP, Minitab, Python, or equivalent.

Responsibilities

  • Lead front-end process development for new products and R&D programs, from first-article builds through qualification and production release; own the process flow for a module and contribute to the integrated flow across photolithography, thin-film deposition, and etch.
  • Set process windows, understand the mechanisms behind them, and serve as the escalation point for module issues in development or production.
  • Partner with R&D and device design on new architectures and material stacks; provide early design-for-manufacturability feedback on layouts, design rules, and stack choices.
  • Drive process integration across modules, including layer interactions, adhesion, film stress, thermal budget, and compatibility with polymer, dielectric, and ceramic barrier stacks.
  • Design and run DOEs and characterization plans; use measurements such as thickness, refractive index, stress, CD, etch rate and profile, FTIR, SEM, and defect inspection to understand processes.
  • Own process and equipment qualification for new processes and tools, including SAT, IQ/OQ/PQ protocols, acceptance criteria, capability studies, and reports suitable for the QMS for Class III implant manufacturing.
  • Lead development-to-production handoff, including process FMEA, control plans, SPC setup, SOPs, work instructions, training, and transfer to the sustaining team.
  • Evaluate, specify, and bring up front-end equipment and materials with vendors; own technical vendor relationships for the assigned module.
  • Plan and track the front-end portion of NPI builds with program management, including schedules, risks, material plans, status, and tradeoffs.
  • Mentor process engineers and technicians; review experiment plans, data, and documentation.
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