Staff Module Design Engineer

Qorvo • Richardson, TX

18d

About The Position

Qorvo is seeking a Staff Electrical Module/Packaging Design Engineer to develop innovative, cutting-edge RF/Microwave module/packaged products. This role involves the design and development of single or multi-chip modules integrating GaN, GaAs, or Silicon-based MMICs in advanced packaging technologies. Depending on experience, there may be opportunities to mentor other team members. The engineer will be a key part of an integrated product development team, collaborating with various departments including marketing, program management, mechanical engineering, product engineering, package engineering, test engineering, applications engineering, manufacturing, operations, quality and reliability, and senior management.

Requirements

• Experience in integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
• Expert-level user in 3D EM simulation tools such as HFSS and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
• Expert in analyzing performance tradeoffs of FEMs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
• Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
• Hands on experience in microwave measurements, characterization, and calibration methods.
• Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon.
• Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
• Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.
• BS Electrical Engineering with 8 or more years of experience OR MS Electrical Engineering with 5 or more years of experience OR PhD Electrical Engineering (with RF/Microwave focus) with 3+ years of relevant experience.

Nice To Haves

• Knowledge of RF signal chain and system analysis is a plus.
• Knowledge of antenna design is a plus.
• Published author in technical journals and/or magazines.
• Strong ability to meet customer technical needs and schedules.

Responsibilities

• Individual Contributor for RF/mm-wave single or multi-chip module (MCM) based product development.
• Integrate MMIC(s) into air cavity or over molded modules towards innovative product solutions.
• Advanced package design using 2.5D and 3D electromagnetic simulators.
• Product checkout, optimization, and design verification testing (DVT) in the test lab.
• Execute DVT analysis and present results to the internal and/or external customer.
• Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior