Staff Mechanical Design Engineer

Marvell Technology•Santa Clara, CA

4d•$100,300 - $150,200

About The Position

We are seeking a Staff Mechanical Design Engineer to join our Advanced Technology Infrastructure team, responsible for the mechanical architecture and detailed design of high performance semiconductor test infrastructures including sockets, optical connectors, silicon photonics FAUs, and thermal head assemblies. This role focuses on delivering mechanically robust, tolerance aware, and production ready designs that enable reliable electrical and thermal systems for next generation high power XPU and Silicon Photonics platforms. You will lead mechanical design efforts spanning precision tolerance management, compliant mechanisms, fluid integrated structures, and scalable architectures, working closely with thermal, packaging, test, and manufacturing partners. This position is ideal for an engineer who excels at turning complex mechanical constraints into elegant, manufacturable designs and enjoys driving hardware from concept through high volume deployment.

Requirements

Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 3-5 years of related professional experience or Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 2-3 years of experience or equivalent professional experience in lieu of a formal degree
Strong mechanical design experience in precision hardware, semiconductor test infrastructure, or high‑tolerance assemblies
Demonstrated expertise in tolerance stack‑up, compliant mechanisms, and mechanical interface design
Proficiency with 3D CAD tools (e.g., NX, SolidWorks, Creo, or equivalent) and drawing standards preferred
Solid understanding of materials, CTE mismatch, contact mechanics, and manufacturability constraints
Strong communication skills and comfort leading technical discussions across disciplines
Ability to translate complex requirements into clear mechanical architectures and detailed designs

Nice To Haves

Experience working closely with thermal engineers and fluid‑based cooling designs preferred
Experience with semiconductor test sockets, handlers, or thermal head assemblies preferred
Familiarity with high‑volume manufacturing and DPPM‑driven quality programs preferred
Exposure to fluid‑integrated mechanical designs and precision machining limitations preferred
Experience supporting prototype bring‑up, lab validation, and production ramp preferred
Prior leadership on cross‑program platform or infrastructure designs preferred

Responsibilities

Own mechanical design and CAD development of test sockets, thermal heads, pedestals, handler design and loading mechanisms for high‑power semiconductor validation platforms
Participate in tolerance stack‑up analysis, managing TIM bond‑line thickness (BLT) and contact stack compliance to prevent die cracking, excessive contact resistance, and reliability degradation
FAU design, CPC connector design, Silicon Photonics Test infrastructure development
Develop compliant mechanical designs, including springs, flexures, and preload structures, to absorb socket manufacturing tolerances and handler misalignment
Design socket‑to‑thermal‑head integration features, ensuring precise alignment, mechanical stability, and repeatable contact under dynamic loading
Architect and detail loading and clamping mechanisms that deliver uniform pressure profiles while meeting handler, automation, and cycle‑time requirements
Design manufacturable internal fluid geometries, including micro‑channels and jet‑impingement manifolds, in collaboration with thermal engineering teams
Reduce DPPM through mechanical precision, owning pedestal planarity, flatness, and uniform pressure mapping across the device interface
Perform manufacturing‑focused tolerance and variation analysis, identifying sensitivity drivers and defining robust design margins
Integrate multi‑zone heaters, sensors, and wiring paths within compact assemblies while maintaining serviceability and mechanical integrity
Select CTE‑matched materials for sockets, pedestals, and structural components to minimize package and fixture warpage across temperature excursions
Develop modular, scalable CAD architectures and reusable design kits to enable rapid customization and high‑volume manufacturing deployment
Drive Design for Manufacturability (DFM) optimization, ensuring complex evaporator and fluid‑integrated geometries are cleanable, inspectable, and mass‑producible
Partner with manufacturing, reliability, and supply‑chain teams to define build processes, inspection methods, and production readiness criteria
Interface with external vendors on machining, surface finishing, coatings, and precision component fabrication
FAU design, CPC connector design, Silicon Photonics Test infrastructure development
Support prototype bring‑up, lab validation, and production ramp
Lead cross‑program platform or infrastructure designs