Staff Fab Process Engineer (Semiconductor)

Renesas Electronics•Palm Bay, FL

13h•Hybrid

About The Position

We are seeking a Staff‑level Process Engineer to provide technical leadership and ownership of Chemical Mechanical Planarization (CMP) and Diffusion / Thermal Processing modules within a high‑volume semiconductor wafer fabrication facility. This role is accountable for process stability, yield improvement, defect reduction, cost optimization, and technology scaling, while serving as a technical mentor and cross‑functional leader across manufacturing, equipment, yield, and integration teams. The ideal candidate brings deep hands‑on process expertise, strong data‑driven problem‑solving skills, and the ability to lead complex excursions and continuous improvement initiatives with factory‑level impact.

Requirements

Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related discipline
8–12+ years of experience as a process engineer in a semiconductor wafer fabrication facility
Demonstrated hands‑on expertise in CMP and diffusion/thermal processing in a high‑volume manufacturing environment
Strong understanding of: Defect mechanisms and yield learning; Equipment‑to‑process interactions; Statistical process control and data‑driven problem solving
Proven track record of sustained yield, cost, reliability, or cycle‑time improvement
Ability to work independently while leading complex, multi‑disciplinary technical efforts
The candidate must be a U.S. citizen or U.S. Person.

Nice To Haves

Experience in analog, mixed‑signal, or specialty semiconductor technologies
Direct experience interfacing with equipment and materials suppliers
Experience supporting technology transfers, capacity ramps, or major process changes

Responsibilities

Serve as module owner for CMP and diffusion/thermal processes with accountability for process capability (Cp/Cpk), yield, reliability, and cost of ownership
Define, maintain, and continuously improve process recipes, specifications, and control plans
Lead root cause analysis and containment for excursions, parametric shifts, and yield detractors using structured problem‑solving methodologies
Drive long‑term process improvements aligned with technology roadmaps and product requirements
Own and optimize CMP processes, including: Oxide, silicon, and Poly Silicon; Slurry selection, pad conditioning strategies, and consumables lifecycle; Defectivity reduction (scratches, dishing, erosion), WIWNU, and surface quality control
Interface with equipment and materials suppliers to drive tool matching, material optimization, and cost reduction
Lead CMP‑related yield learning, defect reduction, and tool/process qualification activities
Own diffusion and thermal process flows, including: Oxidation (dry and wet); Furnace and RTP anneals (spike, soak, and drive‑in); Dopant activation, junction depth control, and thermal budget optimization
Improve sheet resistance control, uniformity, repeatability, and process margins
Drive equipment performance improvements and recipe optimization for high‑volume manufacturing
Partner closely with manufacturing, equipment engineering, yield, and device integration teams to maximize line performance
Provide rapid technical response to production issues and line interruptions
Lead process change management, including qualification plans, documentation, and FMEA‑based risk assessments
Apply statistical methodologies (SPC, DOE, regression, multivariate analysis) to guide process decisions
Analyze inline metrology, defect inspection, parametric, and electrical test data to identify trends and opportunities
Develop and deploy robust process control strategies to prevent recurrence of known failure modes
Act as a technical mentor for senior‑ and mid‑level process engineers
Contribute to fab‑wide best practices, documentation standards, and knowledge sharing
Influence technical direction beyond assigned modules through experience, judgment, and credibility