Staff Equipment Development Engineer - Advanced Packaging

Micron Technology • Boise, ID

2d

About The Position

The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and AI-enabled technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is molding the future of technology! As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron’s leadership in semiconductor manufacturing.

Requirements

• Master’s Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
• 2+ years of semiconductor process or equipment engineering experience
• Fundamental understanding of post probe and assembly process and equipment interactions.
• Understanding of related inline/electrical/probe failure.
• 2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
• Ability to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitments
• Hands on experience with wafer / assembly tools and overlay systems

Nice To Haves

• Ph.D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experience
• Knowledge of robotics, machine logic language, or new hardware design is desirable.
• Wafer or die bonding, plating, warpage control and packaging field experience preferable.

Responsibilities

• Develop strategies and implement to improve Equipment maturity for (FOAK) hardware.
• Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing.
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products.
• Optimizing equipment to reduce cost, increase availability, and improve hardware and process capability.
• Collaborating with process development teams to develop innovative new solutions.
• Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.
• Performing fundamental research to drive innovative solutions for next-generation equipment products.
• Support equipment transfer to production facilities (some domestic or international travel may be required).

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior