Staff Equipment Development Engineer, Advanced Packaging

Micron • Boise, ID

10d

About The Position

As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron’s leadership in semiconductor manufacturing.

Requirements

• Master’s Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
• 2+ years of semiconductor process or equipment engineering experience
• Fundamental understanding of post probe and assembly process and equipment interactions.
• Understanding of related inline/electrical/probe failure.
• 2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
• Ability to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitments
• Hands on experience with wafer / assembly tools and overlay systems
• Ability to use and apply AI tools to streamline work processes, accelerate productivity, and drive enhanced quality and creativity.

Nice To Haves

• Ph. D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experience
• Knowledge of robotics, machine logic language, or new hardware design is desirable.
• Wafer or die bonding, plating, warpage control and packaging field experience preferable.

Responsibilities

• Develop strategies and implement to improve Equipment maturity for (FOAK) hardware.
• Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing.
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products.
• Optimizing equipment to reduce cost, increase availability, and improve hardware and process capability.
• Collaborating with process development teams to develop innovative new solutions.
• Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.
• Performing fundamental research to drive innovative solutions for next-generation equipment products.
• Support equipment transfer to production facilities (some domestic or international travel may be required).

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior