Staff Engineer, Reliability

Murata AmericaSan Diego, CA
$155,132 - $201,683Onsite

About The Position

The Reliability Engineering role ensures that semiconductor products, packages, and processes meet required reliability, quality, and performance standards throughout the product lifecycle. The role defines and executes reliability qualification plans, develops and applies appropriate stress tests, analyzes results, and provides technical reports and recommendations to internal teams and customers. The role partners closely with Design, Product, Package, Process, and Test Engineering teams to understand new products and technologies, identify potential reliability risks, and validate long‑term robustness using industry‑standard and risk-based methodologies. The role also supports continuous improvement of test methods, hardware, and procedures to enhance efficiency, accuracy, and product performance across pSemi’s diverse product portfolio.

Requirements

  • 8+ years in reliability engineering with breadth across product/package/process qualifications.
  • Ability to lead complex qualifications and manage schedules/risks across multiple programs.
  • Advanced RF instrumentation capability, including RFHTOL experience.
  • Competence in scripting/automation for data collection (e.g., Python, LabVIEW).
  • Customer communication experience; able to defend methods/results in reviews.
  • Demonstrated ability to resolve complex hardware and test stability issues with structured problem solving.
  • Demonstrated experience in one or more of the following areas, RFIC, sensor ASICs, or PMIC product qualification is required, depending on products supported.
  • Expertise applying JEDEC/AEC‑Q100 standards and tailoring to product use cases and mission profiles.
  • Proficiency updating controlled procedures and work instructions; familiarity with audits.
  • Skill in DOE design and acceptance criteria for hardware validation and method changes.
  • Understanding of reliability drivers for RF and/or power ICs, including thermal behavior, electrical overstress mechanisms, and application-specific stress conditions.

Nice To Haves

  • Master's degree preferred.

Responsibilities

  • Implement automation and data pipelines to improve test throughput and data integrity.
  • Refine stress matrices, sample sizes, and guard‑bands using risk assessments and field use conditions.
  • Resolve complex test hardware issues (e.g., RFHTOL instability) and implement corrective actions.
  • Direct end‑to‑end execution of reliability qualifications and ensure evidence meets internal, industry, and customer standards.
  • Plan lab capacity and material readiness to meet multiple concurrent qualification schedules.
  • Validate new fixtures, sockets, and burn‑in boards against DOE‑based acceptance criteria.
  • Present technical reports to customers and internal leaders, defending methodology, data, and conclusions.
  • Train engineers and technicians and provide feedback on test approaches and data quality.
  • Partner with Design/Product/Package teams to derive worst‑case use conditions and translate them to stress profiles.
  • Recommend changes to procedures and author controlled documentation to standardize methods across programs.
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