Staff Engineer, HBM Test Vehicle Design

Micron • Richardson, TX

7d

About The Position

Micron Technology is seeking a Staff Engineer for its HBM Design Technology Package Co-Optimization (DTPCO) organization. This role will lead the design and development of test vehicles to enable technology learning and risk reduction for future HBM products. The engineer will be a key technical contributor, collaborating with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams. The position involves translating product requirements and technology challenges into test vehicle solutions, applying expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging. The focus is on developing representative test vehicles and characterization structures to enable learning and support product decisions across future HBM generations, rather than owning traditional product blocks.

Requirements

• Master’s degree or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics, or related field.
• 5+ years of semiconductor experience in design, product engineering, packaging, technology development, or related subject areas.
• Strong understanding of semiconductor design and physical implementation fundamentals.
• Experience with silicon validation, characterization, data analysis, or failure investigation.
• Proven ability to work effectively across multiple engineering organizations.
• Proficiency with demonstrating AI and AI-enabled development workflows.

Nice To Haves

• Experience with HBM, DRAM, or advanced memory products.
• Experience designing test structures, test chips, characterization vehicles, or technology demonstrators.
• Knowledge of advanced packaging technologies including TSVs, hybrid bonding, and 3D integration.
• Understanding of reliability qualification methodologies and failure mechanisms.
• Experience using silicon learning to influence future design or technology decisions.
• Strong written and verbal communication skills with the ability to present technical findings to diverse engineering audiences.

Responsibilities

• Serve as a technical lead for HBM test vehicle design and structure development within DTPCO.
• Partner with HBM product, technology and reliability teams.
• Define and implement test structures targeting key learning areas such as package interaction and reliability.
• Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives.
• Analyze silicon characterization and qualification results to identify optimization opportunities and communicate actionable recommendations to Design, Product, and Technology Development teams.
• Support development of product-enveloping experimental vehicles that improve learning and enable reuse across multiple HBM programs.
• Lead technical investigations to understand design, process, and package interactions impacting product performance, reliability, and manufacturability.
• Participate in multi-functional reviews and provide technical recommendations to guide future test vehicle content and priorities.
• Contribute to development of design guidelines, protocols, and lessons learned that improve future product and technology development.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior