Navitas Semiconductor is seeking a Staff Electromechanical Packaging Engineer to join its collaborative team. The company develops gallium nitride (GaN) and high-voltage silicon carbide (SiC) power semiconductor technologies for applications including AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification. Working with a Lead Engineer, this role supports chip-scale packaging design and high-density interconnect (HDI) organic substrate layout for an integrated voltage regulator product line. The engineer collaborates with substrate layout, ASIC design, and manufacturing teams; creates mechanical drawings for substrate fabrication and packaged-part assembly; coordinates with component, assembly, and test vendors; and works with outsourced assembly and test (OSAT) suppliers to establish process baselines from prototype through mass production.
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Job Type
Full-time
Career Level
Senior