Staff Electromechanical Packaging Engineer

NAVITAS SEMICONDUCTOR USA, INC.•Torrance, CA
•$135,000 - $165,000•Onsite

About The Position

Navitas Semiconductor is seeking a Staff Electromechanical Packaging Engineer to join its collaborative team. The company develops gallium nitride (GaN) and high-voltage silicon carbide (SiC) power semiconductor technologies for applications including AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification. Working with a Lead Engineer, this role supports chip-scale packaging design and high-density interconnect (HDI) organic substrate layout for an integrated voltage regulator product line. The engineer collaborates with substrate layout, ASIC design, and manufacturing teams; creates mechanical drawings for substrate fabrication and packaged-part assembly; coordinates with component, assembly, and test vendors; and works with outsourced assembly and test (OSAT) suppliers to establish process baselines from prototype through mass production.

Requirements

  • Bachelor of Science in Mechanical or Electrical Engineering.
  • At least 3 years of experience with microelectronics packaging and/or PCB design.
  • Understand how electrical design requirements affect substrate layout and interconnect selection.
  • Be proficient with 3D mechanical CAD software, such as Creo, NX, or Catia, and with generating mechanical drawings and GD&T.
  • Be able to read and create electrical schematics.
  • Have familiarity with wafer and substrate tape-out processes.
  • Have a basic understanding of Form, Fit, Function elements in design for manufacturability (DFM).
  • Be willing to learn new concepts and techniques.

Nice To Haves

  • Master's degree or higher.
  • Knowledge of foundry processes and chip-scale assembly processes.
  • Familiarity with PCB design tools such as Altium, Cadence, or Mentor.
  • Basic understanding of component-level thermal analysis.

Responsibilities

  • Support chip-scale packaging design and HDI organic substrate layout for the integrated voltage regulator product line.
  • Collaborate with substrate layout, ASIC design, and manufacturing engineers.
  • Create mechanical drawings for substrate fabrication and packaged-part assembly.
  • Work with vendors for components, assembly, and test.
  • Work with OSAT suppliers to establish process baselines from prototype to mass production.
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