Staff Electromechanical Design Engineer

Northrop Grumman•Baltimore, MD

2d•$169,000 - $253,600•Onsite

About The Position

Northrop Grumman Mission Systems is seeking a Staff Electromechanical Design Engineer to join their team. This position is located in Linthicum, Maryland and requires 100% on-site work. The role involves designing, prototyping, and providing production support for state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies. The engineer will collaborate within a cross-functional Integrated Product Team (IPT), communicating effectively with peers in electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing. Responsibilities include organizing and prioritizing tasks to meet project milestones within schedule and budget, and providing technical leadership and mentoring to less experienced personnel. This position is contingent upon contract award and the ability to obtain an active US Government Secret Clearance or the successful transfer of an active US Government Secret Clearance prior to start.

Requirements

Bachelor’s degree with 12 years of experience, a master’s degree with 10 years of experience or a PhD with 8 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.; will consider 4 years of applied experience in lieu of degree requirement.
U.S Citizenship required.
The ability to obtain/maintain an active US Government Secret clearance
Minimum 12 years of professional experience in PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate/PWB layout.
Minimum 12 years of professional experience applying materials, specifications, manufacturing processes, and design tools used for multi-chip modules, PWBs, and CCAs.
Minimum 12 years of professional experience using AutoCAD, Xpedition, or both for design and layout activities.
Minimum 12 years of professional experience using NX or comparable 3D modeling software.

Nice To Haves

Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
A current/active US Government Secret Clearance or higher
Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
Familiarity with thermal and structural analysis considerations, methodologies, and software tools
Experience with hands-on assembly and testing of prototype electronic hardware
Experience in a technical leadership role on a cross-functional product development team
Experience routing RF signals

Responsibilities

Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
Providing technical leadership and mentoring to less experienced personnel.