Micron Technology's Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions, specifically High Bandwidth Memory (HBM) products. These products are designed for AI/ML, high-performance computing (HPC), and data-centric systems, aiming to deliver industry-leading performance, power efficiency, and reliability. The HBM product family is experiencing significant growth due to high demand from leading semiconductor companies. As an HBM Memory Design Engineer – Sustaining (Staff), you will play a crucial role in analyzing and resolving silicon issues across HBM products by collaborating closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD). You will also work with architecture teams to understand and implement design updates, supporting both silicon release and ongoing product lifecycle needs. This role requires strong AI-driven technical execution and the ability to independently drive complex issues to closure.
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Job Type
Full-time
Career Level
Senior