Sr Staff Advanced Package Design Engineer - 19001

Synopsys•Sunnyvale, CA

7d•$165,000 - $248,000•Onsite

About The Position

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation. You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges. With more than a decade of hands-on experience in package and interposer design, you possess a deep understanding of the latest advancements in 3DIC and multi-physics analysis. Your expertise spans across multiple advanced packaging technologies, and you are enthusiastic about pushing the boundaries of what’s possible in high-performance, energy-efficient chip design. You thrive in a collaborative and fast-paced environment, working seamlessly with multidisciplinary teams and customers to solve technical challenges creatively and efficiently. Your strong analytical skills, coupled with your ability to communicate complex technical concepts clearly, make you a trusted advisor and mentor within your team. You are comfortable working with industry-leading EDA tools and have a solid foundation in both Windows and Linux environments. Your commitment to continuous learning and innovation drives you to stay updated with emerging trends and technologies. You approach every project with a can-do attitude and demonstrate adaptability, resilience, and a relentless pursuit of excellence. You are excited by the opportunity to make a significant impact at Synopsys, contributing to groundbreaking products that shape the future of technology.

Requirements

Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).
Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
Expert knowledge of advanced circuit and transmission line theory.
Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
Familiarity with both Windows and Linux operating systems.
Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.

Nice To Haves

A creative problem solver with strong analytical and critical thinking skills.
An excellent communicator, able to explain technical concepts to diverse audiences.
A collaborative team player who values inclusivity, diversity, and shared success.
Adaptable, quick to learn, and enthusiastic about adopting new technologies and methodologies.
Detail-oriented, quality-driven, and committed to continuous improvement and innovation.
Self-motivated with a strong sense of ownership and accountability.

Responsibilities

Collaborating with cross-functional teams during early design stages to optimize and define SIPI (Signal Integrity/Power Integrity) performance requirements, including bump mapping and power estimation.
Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.
Resolving a wide range of design and integration issues using creative, data-driven approaches.
Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies.