Advanced Package Design Senior Staff Engineer

Marvell Technology•Santa Clara, CA

2d•$141,150 - $211,400

About The Position

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance‑driven systems. Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next‑generation connectivity and compute products. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high‑speed interfaces. This work directly shapes product performance, reliability, and time‑to‑market, making it a key contributor to Marvell’s overall technology leadership. Marvell's Central Engineering team is seeking a highly motivated High-Speed IC Package Development Engineer to develop advanced microelectronic packaging solutions for next-generation semiconductor products supporting 448 Gb/s data rates and beyond. In this role, the engineer will lead package development and electrical design activities, including floorplanning, netlist creation, and BGA map definition, while optimizing signal integrity, power integrity, performance, manufacturability, reliability, and cost. The engineer will work closely with package operations teams to evaluate package technologies, drive layout implementation, and ensure designs meet product and manufacturing requirements. Partnering with marketing, system architects, and IC design teams, the engineer will define package requirements, develop achievable specifications, and contribute to the advancement of next-generation packaging technologies.

Requirements

At least a Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 7+ years of related professional experience OR a Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5+ years of experience.
Experience with high-speed electronic packaging for digital and analog ICs, package floor planning, netlist, schematic and BGA map development.
Experience with 2.5D/3D package development.
Knowledge of packaging technologies, materials, package substrate design rules and assembly rules.
Ability to manage package design and development involving various cross functional teams like IC physical layout teams, Analog and Digital designers, SI/PI teams, thermal-mechanical teams, assembly development, and marketing.
Basic proficiency with IC package floor planning tools like integrated system planner (ISP) and layout tools like APD.
Strong fundamentals in EM, transmission lines and microwave theory.
A team player.
Strong communication, presentation, and documentation skills.

Nice To Haves

Experience with CPC/CPO connectors is highly desired.
Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity is highly desired.
Power plane design, modeling and analysis using tools like PowerSI, SIwave is highly desired.
Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
Track record of new product introduction from concept, through development and production is a plus.

Responsibilities

Lead package development and electrical design activities, including floorplanning, netlist creation, and BGA map definition.
Optimize signal integrity, power integrity, performance, manufacturability, reliability, and cost.
Work closely with package operations teams to evaluate package technologies and drive layout implementation.
Ensure designs meet product and manufacturing requirements.
Define package requirements and develop achievable specifications in partnership with marketing, system architects, and IC design teams.
Contribute to the advancement of next-generation packaging technologies.