Sr Principal Semiconductor Equipment Engineer

Northrop Grumman•Apopka, FL

1d•$122,800 - $184,200•Onsite

About The Position

Northrop Grumman Mission Systems is seeking a Sr. Principal Semiconductor Equipment Engineer for their Advanced Packaging Technology Fab in Apopka, Florida. This role involves supporting Northrop Grumman’s semiconductor foundry and packaging lines, which have capabilities for various microelectronic devices and leading-edge technology development. The wafer bumping line will support flip chips, 2.5D, and 3D packaging with diverse bump compositions and technologies. The Semiconductor Equipment Engineer will lead and manage engineering projects related to equipment layout, cleanroom construction, and installation of semiconductor equipment, as well as oversee daily and long-term equipment maintenance. Responsibilities include facilities and factory layout, developing continuous improvement programs, project management (including contractor direction), and potentially managing groups of tools from daily maintenance to service contracts with vendors.

Requirements

A bachelor’s degree in related STEM field with a minimum of 8 years of relevant work experience; OR a master’s in a related STEM field with 6 or more years of relevant work experience; OR 12 years of relevant work experience in lieu of a degree.
A minimum of 6 years of experience working with semiconductor fabrication equipment or the construction industry.
Experience with semiconductor wafer fabrication facilities and operation.
Experience with fab facility, equipment installation, and maintenance.
Experience with Computerized Maintenance Management System.
Ability to obtain and maintain a Secret clearance.
US Citizenship required.

Nice To Haves

Experience with semiconductor equipment.
Experience with semiconductor clean room design and construction.
Experience with Architecture and Engineering (“A&E”) drawing sets.
Experience with AutoCAD design.
Experience managing strategic projects from inception through completion; including financial, risk and schedule management.
Experience in low volume/high product mix environments.
Experience interfacing with vendors for equipment repairs, service contracts, and purchase preferred.
Active Secret clearance.

Responsibilities

Lead and manage engineering projects such as equipment layout, cleanroom construction and installation of semiconductor equipment.
Oversee daily, weekly, bi-weekly, quarterly, semiyearly and year equipment maintenance.
Manage all aspects of facilities and factory layout for foundry equipment.
Develop and apply continuous improvement programs.
Manage all aspects of project management including working with and direction of contractors/sub-contractors along with alignment with management.
Run a group or groups of tools, from day-to-day maintenance/preventative maintenance operations (i.e. chemical management) up to and including service contracts with vendors.