Sr. Principal Design Engineer

Northrop Grumman•Buffalo, IL

1d•Hybrid

About The Position

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. Our Engineering and Sciences (E&S) organization pushes the boundaries of innovation, redefines engineering capabilities, and drives advances in various sciences. Our team is chartered with providing the skills, innovative technologies to develop, design, produce and sustain optimized product lines across the sector while providing a decisive advantage to the warfighter. Come be a part of our mission! Northrop Grumman offers challenging career opportunities in Hardware Engineering within the Mission Systems Sector that play a key role in the mission to protect our military personnel. The Hardware Engineering organization is dedicated to consistently providing high quality product designs in support of multiple product areas. The Design Data and Product Integrity Engineering (DDPIE) organization provides engineering support services for all programs at the Rolling Meadows campus including Design Layout Technology, Configuration Management, Data Management, Drafting, Standards and Components, Product Follow, and Product Integrity Engineering. Northrop Grumman Mission Systems is seeking an experienced Sr. Principal Design Engineer to join its Design Layout Technology team. The Sr. Principal Design Engineer uses their expert knowledge in Circuit Card Assembly (CCA) and Printed Circuit Board (PCB) fabrication to generate and maintain design rules, perform design for manufacturing checks, generate PCB notes for fabrication. Calculates layer stack-up based on industry standards, supplier capabilities, and engineering requirements. Utilizes computer-aided design graphic tools such as Cadence Allegro and Valor NPI to generate the required electronic data file outputs for fabrication and manufacturing and runs design for manufacturing checks. Uses their excellent communication skills to be the team's main interface with CCA and PCB suppliers. Understands technical theories of electrical and mechanical behavior of PCBs to influence layout decisions (i.e. impedance matching, differential pairs, strains and stresses, orientation of components, etc.) This Role is based in Rolling Meadows, IL as the primary work location. However, this role may consider hybrid work capability reporting to one of these other Northrop Grumman Mission Systems Locations: Amherst, NY., Apopka, FL., Charlottesville, VA., Sykesville, MD. or Annapolis, MD.

Requirements

Bachelor's degree in STEM field with 8 years of experience, or Master's degree in STEM field with 6 years of experience OR in lieu of the degree an additional 4 years of relevant work experience.
Experience in PCB fabrication and layer stack-up for digital, RF, mixed signal, and power supply CCAs.
Experience with Cadence Allegro or similar CAD tool.
Expert knowledge of industry specifications and design for manufacturing (DFM) rules for CCA and PCB design, fabrication and manufacturing.
Must be able to read drawings and schematic diagrams.
US Citizenship and the ability to obtain and maintain a security clearance.

Nice To Haves

Advanced degree in STEM field.
Experience in quality and testing of CCAs and PCBs.
Good self-organizing, and communication skills.

Responsibilities

Generate and maintain design rules for Circuit Card Assembly (CCA) and Printed Circuit Board (PCB) fabrication.
Perform design for manufacturing checks.
Generate PCB notes for fabrication.
Calculate layer stack-up based on industry standards, supplier capabilities, and engineering requirements.
Utilize computer-aided design graphic tools such as Cadence Allegro and Valor NPI to generate electronic data file outputs for fabrication and manufacturing.
Run design for manufacturing checks.
Serve as the team's main interface with CCA and PCB suppliers.
Understand technical theories of electrical and mechanical behavior of PCBs to influence layout decisions (i.e. impedance matching, differential pairs, strains and stresses, orientation of components, etc.).