Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high-performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Circuits’ products are used in a range of wired and wireless communications applications. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment. Mini-Circuits’ sells its products to over 20,000 customers globally through our direct sales force, applications engineering staff, sales representatives, as well as through our extensive Position Summary: The Sr. Packaging Engineer is responsible for leading the development and execution of all packaging processes supporting MMIC. This role owns MMIC packaging and process development to drive innovation and ensure optimal performance. Working closely with Quality & Reliability, CAD and other Engineering teams, as well as internal and external package assembly houses, this position guides projects from design conception through release-to market ensuring alignment with long-term goals.
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Job Type
Full-time
Career Level
Senior