Sr Mgr, PKG Process Integration

Qorvo • Greensboro, NC

6d

About The Position

Qorvo supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. This role will lead the Integrate Circuit (IC) Packaging Technologies Roadmap for all of the organization’s products and oversee the execution of R&D Projects for the Short- and Long-Term roadmap. The position also involves overseeing the development and hiring of highly skilled technical personnel and leading R&D skunkworks technologies for a 3+ years roadmap. The goal is to ensure that Qorvo manufacturing internal or external sites are ready with leading technology (materials, design rules, new packaging, and equipment capabilities). This includes working with Assembly Processes, IC Packaging Technologies, and High-Volume Manufacturing. The role requires understanding packaging technologies for diverse packages to include four of the following: DSMBGA, DSMLGA, LGA, MCM, WLCSP, or Leadframe, etc., for addressing company needs & offer cost-quality effective solutions. The position also involves systematically maintaining technology leadership on packaging design rules for optimizing modules in terms of performance, cost of ownership & size, and implementing a system for ideating, qualifying & deploying technologies for smooth New Product Introduction execution. Management experience in Packaging and Assembly of Semiconductors, and with System in Packages is required, along with experience in assembly processes such as SMT, Die Attach, Wire Bond, Molding, Marking, and Shielding, and methodologies such as Six Sigma, Lean. Strong High Volume manufacturing experience in semiconductor assembly technologies/products is also essential. The role includes occasional domestic travel to meet with customers and international trips two to three times a year.

Requirements

• Bachelor’s degree in Electrical Eng.’g., Mechanical Eng.’g., Semiconductors, Materials, or Electronic Engineering, or related field.
• 12 years of experience in Assembly Processes, IC Packaging Technologies, and High-Volume Manufacturing.
• 12 years of experience understanding packaging technologies for diverse packages to include four of the following: DSMBGA, DSMLGA, LGA, MCM, WLCSP, or Leadframe, etc., for addressing company needs & offer cost-quality effective solutions.
• 12 years of experience in Systemic Design Rule Improvement Plan to include systematically maintain technology leadership on packaging design rules for optimizing modules in terms of performance, cost of ownership & size.
• 12 years of experience in Systemic packaging technology development to include implementing a system for ideating, qualifying & deploying technologies for smooth New Product Introduction execution.
• 10 years of experience in Management experience in Packaging and Assembly of Semiconductors, and with System in Packages.
• 10 years of experience in assembly process such as SMT, Die Attach, Wire Bond, Molding, Marking, and Shielding.
• 10 years of experience in methodologies such as Six Sigma, Lean.
• 10 years of strong High Volume manufacturing experience in semiconductor assembly technologies/products.

Responsibilities

• Lead Integrate Circuit (IC) Packaging Technologies Roadmap for all of the organization’s products.
• Lead the execution of R&D Projects for the Short- and Long-Term roadmap.
• Oversee the development and hiring of highly skilled technical personnel.
• Lead R&D skunkworks technologies for 3+ years roadmap.
• Ensure that Qorvo manufacturing internal or external sites are ready with leading technology (materials, design rules, new packaging, and equipment capabilities).
• Work with Assembly Processes, IC Packaging Technologies, and High-Volume Manufacturing.
• Understand packaging technologies for diverse packages to include four of the following: DSMBGA, DSMLGA, LGA, MCM, WLCSP, or Leadframe, etc., for addressing company needs & offer cost-quality effective solutions.
• Systematically maintain technology leadership on packaging design rules for optimizing modules in terms of performance, cost of ownership & size.
• Implement a system for ideating, qualifying & deploying technologies for smooth New Product Introduction execution.

What This Job Offers

• Job Type: Full-time
• Career Level: Manager