Sr. Mechanical Engineer, RF Payloads - TeraWave

BLUE ORIGIN•Seattle, WA

1d•$145,188 - $203,263

About The Position

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight! Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide. This Mechanical Engineer IV role leads mechanical engineering efforts for RF payload hardware supporting Blue Origin's TeraWave satellite communications network, including phased array antenna structures and RF module packaging. This role acts as the technical point of contact bridging mechanical design with RF and electrical engineering teams, leading architecture trade studies, guiding supplier and manufacturing partner technical decisions, and coordinating across programs. This position also mentors junior and mid-level engineers to build mechanical packaging capability across the team.

Requirements

Bachelor's degree in Mechanical Engineering or a related technical field.
8+ years of experience in mechanical design and packaging of complex electronic hardware systems.
Proficiency with 3D CAD tools, such as CATIA, SolidWorks, or NX, for assembly modeling.
Experience performing structural and thermal analyses using analytical methods or finite element software tools.
Experience applying GD&T principles and engineering drawing standards, including ASME Y14.5, in mechanical designs.

Nice To Haves

Master's degree in Mechanical Engineering or a related technical field, supporting advanced RF hardware design.
Knowledge of thermal management technologies, including heat sinks and thermal interface materials, for high-power RF hardware.
Experience packaging RF hardware for space-qualified systems, including radiation, thermal vacuum, and vibration environments.
Experience mentoring junior and mid-level mechanical engineers on RF payload packaging design and development practices.
Familiarity with phased array antenna mechanical integration, including panel-level packaging and beamforming module thermal design.
Experience leading design for manufacturability and testability efforts with contract manufacturers for RF hardware production.
Strong written and verbal communication skills, with the ability to present technical content to cross-functional stakeholders.

Responsibilities

Lead design and packaging of mechanical structures for phased array antennas and RF payload hardware assemblies.
Direct thermal management strategies for high-power RF payload electronics, ensuring compliance with performance and reliability requirements.
Perform structural and thermal analyses, including tolerance stack-ups, to validate RF payload mechanical designs.
Lead architecture trade studies to define mechanical packaging approaches for RF payload hardware across programs.
Serve as technical point of contact for RF payload mechanical design, coordinating closely with electrical and RF engineering teams.
Provide technical leadership to suppliers and manufacturing partners, ensuring producibility of RF payload mechanical hardware.
Coordinate mechanical engineering efforts across programs to align RF payload packaging requirements with electrical interfaces.
Mentor junior and mid-level mechanical engineers on RF payload packaging design and analysis practices.