Sr. Electircal Engineer, RF Payloads - TeraWave

BLUE ORIGIN • Seattle, WA

1d • $156,802 - $219,522

About The Position

This Electrical Engineer IV role leads electrical engineering efforts for the RF payload hardware supporting Blue Origin's TeraWave satellite communications network, a next-generation constellation designed to deliver aggregate global network capacity of up to 6 Tbps. This role acts as the technical point of contact bridging high-speed digital logic and phased array antenna systems, leading architecture trade studies, guiding supplier and vendor technical decisions, and coordinating across programs. This position also mentors junior and mid-level engineers to build electrical engineering capability across the team.

Requirements

• Bachelor's degree in Electrical Engineering or a related technical field.
• 8+ years of experience in complex hardware product development, such as telecom or aerospace electronics.
• Proficiency with EDA tools, including Altium Designer or Cadence Allegro, for high-speed mixed-signal PCB layout.
• Experience designing power delivery networks for high-power, dynamic electronic systems including DC-DC converters.
• Experience using spectrum analyzers, vector network analyzers, and high-speed oscilloscopes for hardware debug and validation.

Nice To Haves

• Master's degree in Electrical Engineering or a related technical field, supporting advanced RF payload development.
• Strong understanding of RF concepts, including impedance matching, shielding, and insertion loss, to support antenna integration.
• Experience mentoring junior and mid-level electrical engineers on RF payload hardware design and development practices.
• Familiarity with satellite communication protocols or commercial high-speed wireless infrastructure, including 5G and Wi-Fi 6E/7 systems.
• Experience designing hardware architecture around Xilinx/AMD Zynq SoCs, Altera/Intel FPGAs, or high-speed ARM processors.
• Track record designing hardware that successfully passes regulatory compliance testing, such as FCC Part 15/25 or CE.
• Knowledge of thermal management strategies for high-power density boards and outdoor, weather-proof enclosure design practices.

Responsibilities

• Develop multi-layer, high-density interconnect PCB designs, ensuring isolation between high-speed digital lines and microwave routing.
• Design efficient power systems, including PoE, DC-DC converters, and PMICs, supporting high dynamic current beamforming loads.
• Lead simulation and analysis efforts to minimize noise, crosstalk, and electromagnetic interference across payload systems.
• Lead architecture trade studies to define RF payload hardware approaches across multiple subsystems and programs.
• Serve as technical point of contact for RF payload hardware, driving design decisions independently across the subsystem.
• Direct physical bring-up, hardware debugging, and functional lab testing for system-level RF payload boards.
• Provide technical leadership to suppliers and vendors, ensuring RF payload hardware meets program requirements.
• Coordinate technical efforts across programs and mentor junior and mid-level engineers on RF payload hardware design.

Benefits

• Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
• Stock Options for all regular employees (working at least 20 hours/week)
• Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior