Sr. Engineer, Package Design

Tenstorrent•Austin, TX

9d•$100,000 - $500,000•Hybrid

About The Position

Tenstorrent is seeking a designer to create board-level routing studies, design mock-ups, and SI/PI modeling collateral that support advanced semiconductor package development. This role is focused on early-stage package/board co-design rather than production PCB release. The designer will work closely with signal integrity, power integrity, mechanical, and system teams to develop representative PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling.

Requirements

3+ Years experience with Cadence Allegro PCB Designer.
Experience with high-pin-count BGAs and complex connectivity requirements.
Ability to analyze routing congestion, layer utilization, and signal escape strategies.
Working knowledge of Signal and Power Integrity principles.
Strong communication skills and the ability to collaborate across multiple engineering disciplines.

Nice To Haves

An experienced PCB designer looking to expand into advanced semiconductor packaging and package-board co-design.
Comfortable working in ambiguous problem spaces and using engineering judgment to evaluate multiple implementation tradeoffs.
Interested in understanding how package architecture, BGA design, and board implementation influence overall system performance.
Motivated by solving complex routing, connectivity, and electrical design challenges.
Excited to apply automation, data analytics, and emerging AI techniques to improve engineering workflows.

Responsibilities

Create board-level routing studies.
Design mock-ups.
Develop SI/PI modeling collateral that support advanced semiconductor package development.
Develop representative PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling.
Work closely with signal integrity, power integrity, mechanical, and system teams.