Sr. Engineer, MEMS Assembly

SiTime Corporation

8d•$124,920 - $171,770

About The Position

As a Sr. Engineer, MEMS Assembly, you will use your creativity and technical expertise to bring up and evolve MEMS packaging technologies for SiTime’s next-generation timing products. You will work with assembly and packaging partners and collaborate with design and characterization teams to develop manufacturable, reliable, high-yield MEMS products. SiTime notes that candidates do not need to meet every job requirement to be qualified. The role offers a base salary of $124,920–$171,770 USD and eligibility for a quarterly bonus tied to innovation goals, as well as equity grants. Benefits include a 401(k) plan, medical, dental, vision, life, parental leave, legal services, and time off plans.

Requirements

MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent.
At least 5 years of industrial experience.
Experience with MEMS assembly and packaging.
Solid foundation in MEMS, including a basic understanding of MEMS design and interactions between design, fabrication, and packaging.
Experience with reliability characterization and yield analysis.
Strong organizational skills and ability to manage projects.
Initiative to identify issues, propose tasks, and suggest new development directions.
Excellent critical thinking, ability to design experiments, and ability to interpret results.
Clear and concise scientific communication.
Ability to work well with others in a collaborative, fast-paced team environment.

Nice To Haves

Experience bringing MEMS products to production.

Responsibilities

Manage and work closely with MEMS back-end assembly and packaging partners to develop, evolve, and troubleshoot MEMS wafer-level packaging technologies.
Evaluate the impact of assembly processes on device performance and reliability, and ensure high yield and quality.
Work with MEMS design and characterization teams to ensure products are designed for manufacturability (DFM) and validated.
Coordinate and perform failure analysis to characterize and debug the impact of assembly processes on MEMS devices.
Define next-generation packaging technologies to enable breakthrough timing products.