Sr. Engineer - Chemical Mechanical Polish
About The Position
The Advanced Transducer Development group is a global R&D organization dedicated to developing new recording head technologies to advance areal density and support Seagate’s HDD (Hard Disk Drive) product roadmap for the next four years and beyond. Our process team utilizes state-of-the-art wafer fabrication tools and cleanroom facilities to innovate and deliver leading-edge writers and read sensors. With a focus on proving the feasibility of new devices, processes, and materials, we drive Seagate’s future time-to-market leadership. This role supports the development of Chemical Mechanical Polishing (CMP) processes to achieve planarity, surface quality, and dimensional targets in advanced head devices. The role involves maintaining process stability, analyzing data for statistical process control, supporting investigations of process excursions, and assisting with CMP equipment configuration, qualification, and scheduling. The engineer will collaborate with engineering partners to understand device requirements and ensure alignment between process outputs and design intent. They will also work with cross-functional wafer process teams to integrate CMP processes into development builds, analyze data and report results, support interactions with equipment suppliers, and participate in technology transfer activities. Additionally, the role includes contributing to technical documentation and knowledge sharing.
Requirements
- Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or a related field with 5+ years of experience, or a Master’s degree with 3+ years of experience, or a PhD with 0+ years of experience, or equivalent experience.
- Working knowledge of CMP fundamentals, including slurry chemistry, pad interactions, and material removal concepts.
- Experience supporting semiconductor or wafer fabrication processes.
- Familiarity with thin-film or nanostructure characterization techniques (e.g., AFM, SEM, ellipsometry, or similar).
- Experience analyzing data and applying basic statistical methods.
- Experience supporting or operating process equipment in an R&D or manufacturing environment.
- Ability to work with data and contribute to problem-solving activities.
- Self-motivated and interested in developing technical expertise in a manufacturing and R&D environment.
- Able to work with guidance while handling multiple assignments and priorities.
- Collaborate effectively with engineers and technicians across teams.
- Detail-oriented and able to document and communicate results clearly.
- Interested in learning new processes, tools, and technologies.
- Comfortable working in clean room and laboratory environments.
Nice To Haves
- Exposure to advanced characterization techniques or analytical tools.
- Experience with statistical tools such as JMP or similar.
- Familiarity with semiconductor process integration or advanced wafer technologies.
- Exposure to process development or R&D environments.
Responsibilities
- Support the development of Chemical Mechanical Polishing (CMP) processes to achieve planarity, surface quality, and dimensional targets in advanced head devices.
- Assist in maintaining process stability by analyzing data for statistical process control and supporting investigations of process excursions.
- Support configuration, qualification, and scheduling activities for CMP equipment.
- Work with engineering partners to understand device requirements and support alignment between process outputs and design intent.
- Collaborate with cross-functional wafer process teams (lithography, deposition, etch, wet process, and integration) to support integration of CMP processes into development builds.
- Analyze data and report results related to process performance and downstream impact.
- Support interactions with equipment suppliers to assist with process and hardware improvements.
- Participate in activities related to technology transfer to product engineering teams.
- Contribute to technical documentation and support knowledge sharing across the team.
Benefits
- eligibility to participate in discretionary bonus program
- medical, dental, vision, and life insurance
- short- and long-term disability
- 401(k)
- employee stock purchase plan
- health savings account
- dependent care
- healthcare spending accounts
- paid time off
- 12 holidays
- flexible time off provided pursuant to Seagate policy
- a minimum of 48 hours of paid sick leave
- 16 weeks of paid parental leave
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What This Job Offers
Job Type
Full-time
Career Level
Senior
