Sr. Application Engineer

ASE US INCSunnyvale, CA
$120,000 - $160,000Onsite

About The Position

As a Sr. Application Engineer, you’ll provide support in promoting ASE technology, working with ASE customers to support new product introduction and working with ASE factory engineering teams to maintain production yield, solving field-related application issues. Work with customers to understand and support their product roadmap requirements, maintain ASE leadership position in the semiconductor market. This role involves working with ASE's U.S. sales teams, customers, and the Taiwan factory to evaluate customer’s IC package characteristics (design rules) to perform IC packaging substrate feasibility study and design layout. You will develop a thorough understanding of customer’s technical requirements, as well as their roadmaps for future products and technology requirements. You will also work with the ASE sales team to help customers with high performance and high-speed IC packaging design by utilizing ASE's latest IC packaging design rules and manufacturing processes. The Sr. Application Engineer will provide engineering support to sales teams and customers to achieve optimal IC packaging solutions in terms of manufacturing cycle time, electrical/thermal performance, low cost, and time-to-market. You will also work with the sales team and customers on design changes to resolve design issues and ensure customers’ designs meet ASE’s assembly flow and procedures.

Requirements

  • BS degree in Engineering or a related field
  • At least 8 years of experience in IC packaging and IC assembly
  • Strong working knowledge of IC packaging design rules
  • Familiar with IC assembly quality control flow and QA processes
  • Proficient in MS Outlook, Word, Excel and Power Point
  • Excellent written and oral communication skills
  • Fluent in English
  • Basic math skills
  • Must be flexible
  • Ability to make decisions

Nice To Haves

  • Knowledge of and experience with Silicon Photonics
  • Fluency in Mandarin

Responsibilities

  • Review customers’ devices and feedback to engineering team for IC packages developing to meet specific applications needs.
  • Co-work with manufacturing team from new designs into volume productions.
  • Work closely with R&D groups to develop an advanced package for high speed /high-performance applications
  • Understand IC package thermal electrical & stress characterization & modeling
  • Collect technical & marketing information for process engineering & R&D groups to develop advanced packages.
  • Follow up engineering issues with customers and manufacturing team
  • Perform other job-related duties as assigned.

Benefits

  • Medical
  • Dental
  • Vision
  • Prescription
  • Flex Plan
  • Life Insurance
  • Eligibility for enrollment in our 401 (k) Plan after successfully completing your 90-day introductory period.
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service