Sr Advanced Hardware Engineer

Honeywell Aerospace•Clearwater, FL

1d•Hybrid

About The Position

As a Senior Advanced Hardware Engineer at Honeywell Aerospace Technologies, you will contribute to the design, development, and sustainment of navigation and sensor solutions. The role focuses on mechanical design and development for navigation and sensor products, including printed board assemblies, enclosures, and assemblies. You will use CREO Parametric for modeling and drafting, and conduct thermal and structural finite element analysis using NX Simcenter. You will also perform fatigue analyses, support testing and production issue resolution, collaborate across teams on requirements, and mentor and coach team members. The position reports to the Mechanical Engineering Manager and is based in Clearwater, Florida. A hybrid work option is available after an initial 90-day period. U.S. citizenship is required due to contractual requirements.

Requirements

Bachelor’s degree from an accredited institution in a technical discipline such as science, technology, engineering, or mathematics.
10 or more years of experience in mechanical design and development, particularly in defense and commercial electronics.
Excellent problem-solving and analytical skills.
Strong communication and collaboration abilities.
Must be a U.S. citizen due to contractual requirements.

Nice To Haves

Master’s degree in Mechanical Engineering or a related field.
Experience with other CAD software and design tools.
Proficiency with ASME Y14.100 and Y14.100.
Proficiency with finite element analysis principles.
Familiarity with electronics design and analysis for thermal and vibration environments.
Knowledge of industry standards and best practices in mechanical design.
Experience with product testing and validation.
Knowledge of materials and manufacturing processes.

Responsibilities

Use CREO Parametric for 3D modeling, design, and drafting of printed board assemblies, mechanical enclosures, and assemblies.
Conduct thermal and structural finite element analysis using NX Simcenter to assess electronics packaging and printed board assembly performance.
Conduct vibration and thermally induced fatigue analyses using Ansys Sherlock and/or CALCE SARA.
Support production and testing to help resolve issues, including MRB and RCCA matters.
Collaborate with cross-functional teams to define mechanical requirements and specifications.
Design, develop, and analyze complex navigation and sensor components and assemblies.
Keep up to date with industry trends and technologies in mechanical design, printed board assembly design, and electronics packaging.
Support the technical development of the team through mentorship and coaching.