Spice Modeling Engineer

Broadcom•Irvine, CA

2d•$129,400 - $207,000

About The Position

Broadcom is a leading provider of silicon solutions for high-performance computing, networking, mobile, and consumer markets. This position is within Broadcom's Central Engineering organization, specifically on the technology platform team. This team is responsible for delivering CAD, design-access, custom device enhancements to foundry process technologies, silicon correlation, and device & reliability modeling functions to support high-volume product needs across diversified businesses. The role requires an experienced engineer with technical knowledge and hands-on experience in advanced silicon technology, device modeling concepts, measurement automation, data collection & analysis, and GDS to SPICE design flows for silicon correlation using custom process characterization and modeling test-chips. Layout experience with device modeling test-structures is considered beneficial.

Requirements

Device physics and process technology knowledge with 65nm and newer nodes.
Device modeling for HSPICE/SPECTRE circuit simulation.
GDS to SPICE flow in Cadence/Virtuoso.
Device/circuit characterization with DC to RF measurement equipment.
Automation skills for data-analysis and lab equipment.
Excellent communication and presentation skills for working with a world-wide design engineering community.

Nice To Haves

Layout experience with device modeling test-structures.

Responsibilities

Deliver CAD, design-access, custom device enhancements to foundry process technologies.
Perform silicon correlation and device & reliability modeling functions.
Utilize advanced silicon technology and device modeling concepts.
Implement measurement automation, data collection & analysis.
Execute GDS to SPICE design flows for silicon correlation using custom process characterization and modeling test-chips.
Potentially work with device modeling test-structures, including layout experience.