The Military Avionics group specializes in developing disruptive, next-generation technologies for military aircraft using small company agility and big company experience. The team is seeking an Electronic Packaging Mechanical Engineer specializing in thermal analysis to work with a cross-functional team to assist development, design, and implementation of avionics electronic systems. We are seeking a self-motivated individual contributor with strong thermal analysis skills. The position will follow the product from conceptualization through hardware integration and test, executing the thermal analysis. In this role, you will perform analysis of avionics electronics equipment using first-order thermodynamics and fluid mechanics principles, along with conjugate heat transfer simulations (CFD), to predict system and component-level thermal responses.
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Job Type
Full-time
Career Level
Mid Level