The Military Avionics group specializes in developing disruptive, next-generation technologies for military aircraft using small company agility and big company experience. The team is seeking an Electronic Packaging Mechanical Engineer specializing in thermal analysis to work with a cross-functional team to assist development, design, and implementation of avionics electronic systems. We are seeking a self-motivated individual contributor with strong thermal analysis skills. The position will follow the product from conceptualization through hardware integration and test, executing the thermal analysis. In this role, you will perform analysis of avionics electronics equipment using first-order thermodynamics and fluid mechanics principles, along with conjugate heat transfer simulations (CFD), to predict system and component level thermal responses. The position will interface with Designers, Thermal/Structural Analysts, Systems Engineers, other engineering disciplines, Program Managers, and customer counterparts. The position will require giving input to portions of the mechanical engineering activities related to the design, analysis, documentation, fabrication, assembly, and qualification of product to the specification requirements, typically with stringent technical, schedule, and process requirements, as well as supporting thermal qualification testing. Candidate must have experience in CFD software and be able to work under moderate supervision on tasking that is typically assigned with high-level requirements. Candidate must have the ability to work independently and within a multi-disciplined team environment.
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Job Type
Full-time
Career Level
Entry Level