Specialist, Mechanical Engineering - Thermal Analyst

L3HarrisPalm Bay, FL
Onsite

About The Position

The Military Avionics group specializes in developing disruptive, next-generation technologies for military aircraft using small company agility and big company experience. The team is seeking an Electronic Packaging Mechanical Engineer specializing in thermal analysis to work with a cross-functional team to assist in the development, design, and implementation of avionics electronic systems. We are seeking a self-motivated individual contributor with strong thermal analysis skills. The position will follow the product from conceptualization through hardware integration and test, executing the thermal analysis. In this role, you will perform analysis of avionics electronics equipment using first-order thermodynamics and fluid mechanics principles, along with conjugate heat transfer simulations (CFD), to predict system and component-level thermal responses. The position will interface with Designers, Thermal/Structural Analysts, Systems Engineers, other engineering disciplines, Program Managers, and customer counterparts. The position will require giving input to portions of the mechanical engineering activities related to the design, analysis, documentation, fabrication, assembly, and qualification of product to the specification requirements, typically with stringent technical, schedule, and process requirements, as well as supporting thermal qualification testing. Candidate must have experience in CFD software and be able to work under moderate supervision on tasking that is typically assigned with high-level requirements. Candidate must have the ability to work independently and within a multi-disciplined team environment.

Requirements

  • Bachelor’s Degree and minimum 4 years of prior relevant experience, OR Graduate Degree and a minimum of 2 years of prior related experience, OR In lieu of a degree, minimum of 8 years of prior related experience.
  • Experience in CFD software.
  • Ability to work under moderate supervision on tasking that is typically assigned with high-level requirements.
  • Ability to work independently and within a multi-disciplined team environment.

Nice To Haves

  • First order analysis of heating/cooling thermal management systems (conduction, convection).
  • Experience in CFD software packages: FloTHERM is preferred. Ansys, Icepack, StarCCM, OpenFOAM, etc. acceptable.
  • 2+ years experience in thermal analysis for packaging electronics including design for and testing to military environments (i.e. temperature, vibration, shock, etc.)
  • Experience in 3D CAD modeling – PTC Creo, Catia, NX, Fusion 360, Solidworks, etc.
  • Excellent people skills, with experience working and collaborating in a multi-disciplinary, diverse, and dynamic team environment.
  • Excellent communication skills (written, verbal, & presentation).
  • Strong hands-on capabilities, to include integration of mechanisms and products.

Responsibilities

  • Perform analysis of avionics electronics equipment using first-order thermodynamics and fluid mechanics principles, along with conjugate heat transfer simulations (CFD), to predict system and component-level thermal responses.
  • Interface with Designers, Thermal/Structural Analysts, Systems Engineers, other engineering disciplines, Program Managers, and customer counterparts.
  • Provide input to mechanical engineering activities related to the design, analysis, documentation, fabrication, assembly, and qualification of product to specification requirements.
  • Support thermal qualification testing.
  • Work under moderate supervision on tasking typically assigned with high-level requirements.
  • Work independently and within a multi-disciplined team environment.
  • Derive requirements to support the design.
  • Leverage prior experience to support designs.
  • Seek feedback from SMEs and other knowledgeable colleagues.
  • Question requirements to determine real product needs.
  • Seek out information by interfacing with external disciplines.
  • Assist with new hire and intern onboarding, including support of career fairs and university outreach.
  • Communicate applicable processes and standard operating procedures and their importance and benefits.
  • Establish working relationships in other disciplines and departments such as operations, quality, and procurement.
  • Effectively document and communicate design intent.
  • Provide regular status reporting of accomplishments, issues, challenges, and potential risks.
  • Propose multiple conceptual design solutions.
  • Use knowledge and experience to derive requirements and make technical assumptions.
  • Support execution of tasking that may be critical to the success of the program.
  • Identify issues or risks relative to direct tasking and proactively alert team leadership.
  • Directly contribute to the achievement of critical milestones associated with specific projects (PDR, CDR, TRR, etc).
  • Provide schedule, cost, and technical input at the major subsystem level.
  • Identify and submit process improvement initiatives relevant to daily work.
  • Direct and review the work of new graduate engineers, designers, and technicians.
  • Exhibit a high level of engagement and ownership in the successful completion of assigned tasking.
  • Obtain US government security clearance.
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