This position is part of Intel’s Logic Technology Development (LTD) team, specifically the Resolution Enhancement Technology (RET) team. The team extends the feature sizes that can be patterned on Intel devices using current and future lithography manufacturing tools. It works with fab integrated lithography process and mask manufacturing teams to use computational lithography tools to optimize mask patterns and improve manufacturing process capability. The team also partners with design rule definition teams, using lithography and patterning simulation to determine design rules for future process nodes. The engineer develops and implements Optical Proximity Correction (OPC) algorithms and other Resolution Enhancement Techniques for existing and novel process technologies. The role applies predictive modeling, statistics, machine learning, and other data-analysis methods to fab process data, and develops software to compensate for physical effects in photolithography imaging and etch pattern transfer. It also supports production mask tapeout and RET validation, maintains knowledge of RET and semiconductor technology trends, and creates technical documentation and presentations. The role is hybrid, allowing employees to split time between the assigned Intel site and off-site work. The primary location is Hillsboro, Oregon. The position is an experienced hire on Shift 1. The stated U.S. annual salary range is $149,600–$284,580, with individual pay depending on location and additional factors.
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Job Type
Full-time
Career Level
Senior