Software Intern

Cadence Design Systems • Austin, TX

1d

About The Position

This internship will focus on using machine learning algorithms and large language models in thermal and IR drop applications. You will have the opportunity to help design, develop, troubleshoot and debug PCB/package/chip thermal analysis and power integrity analysis software. Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors. Exercises independent judgment in developing methods, techniques, and evaluation criterion for obtaining results. Work leadership may be provided by assigning work and resolving problems. We’re doing work that matters. Help us solve what others can’t. Cadence plays a critical role in creating the technologies that modern life depends on. We are a global electronic design automation company, providing software, hardware, and intellectual property to design advanced semiconductor chips that enable our customers create revolutionary products and experiences. Thanks to the outstanding caliber of the Cadence team and the empowering culture that we have cultivated for over 25 years, Cadence continues to be recognized by Fortune Magazine as one of the 100 Best Companies to Work For. Our shared passion for solving the world’s toughest technical challenges, our dedication to pushing the limits of the industry, and our drive to do meaningful work differentiates the people of Cadence. Cadence is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, sex, age, national origin, religion, sexual orientation, gender identity, status as a veteran, basis of disability, or any other protected class.

Requirements

• Focus on using machine learning algorithms and large language models in thermal and IR drop applications.
• Design, develop, troubleshoot and debug PCB/package/chip thermal analysis and power integrity analysis software.
• Analyze situations or data requiring evaluation of intangible variance factors.
• Exercise independent judgment in developing methods, techniques, and evaluation criteria for obtaining results.
• Provide work leadership by assigning work and resolving problems.

Responsibilities

• Help design, develop, troubleshoot and debug PCB/package/chip thermal analysis and power integrity analysis software.
• Use machine learning algorithms and large language models in thermal and IR drop applications.
• Evaluate intangible variance factors in complex problems.
• Develop methods, techniques, and evaluation criteria for obtaining results.
• Provide work leadership by assigning work and resolving problems.

What This Job Offers

• Career Level: Intern
• Education Level: No Education Listed