This internship will focus on using machine learning algorithms and large language models in thermal and IR drop applications. You will have the opportunity to help design, develop, troubleshoot and debug PCB/package/chip thermal analysis and power integrity analysis software. Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors. Exercises independent judgment in developing methods, techniques, and evaluation criterion for obtaining results. Work leadership may be provided by assigning work and resolving problems.
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Career Level
Intern
Education Level
No Education Listed