Software Intern

Cadence Design SystemsAustin, TX

About The Position

This internship will focus on using machine learning algorithms and large language models in thermal and IR drop applications. You will have the opportunity to help design, develop, troubleshoot and debug PCB/package/chip thermal analysis and power integrity analysis software. Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors. Exercises independent judgment in developing methods, techniques, and evaluation criterion for obtaining results. Work leadership may be provided by assigning work and resolving problems.

Requirements

  • Focus on using machine learning algorithms and large language models in thermal and IR drop applications.
  • Ability to design, develop, troubleshoot, and debug PCB/package/chip thermal analysis and power integrity analysis software.
  • Ability to analyze situations or data requiring evaluation of intangible variance factors.
  • Ability to exercise independent judgment in developing methods, techniques, and evaluation criteria.
  • Ability to provide work leadership by assigning work and resolving problems.

Responsibilities

  • Design, develop, troubleshoot, and debug PCB/package/chip thermal analysis and power integrity analysis software.
  • Utilize machine learning algorithms and large language models in thermal and IR drop applications.
  • Evaluate intangible variance factors in complex problems.
  • Develop methods, techniques, and evaluation criteria for obtaining results.
  • Provide work leadership by assigning tasks and resolving problems.
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